جائزہ میں چپ انڈسٹری ہفتہ

جائزہ میں چپ انڈسٹری ہفتہ

ماخذ نوڈ: 3072188

By Jesse Allen, Gregory Haley, and Liz Allan

Synopsys گے حاصل جواب for about $35 billion in cash and stock. The deal will boost Synopsys’ multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025.

دنیا بھر میں semiconductor revenue in 2023 totaled $533 billion, a decrease of 11.1% from 2022, according to preliminary results by Gartner. The combined semiconductor revenue of the top 25 semiconductor vendors declined 14.1% in 2023, accounting for 74.4% of the market, down from 77.2% in 2022.

However, simple formulas on how the chip industry is doing no longer apply. There are too many variables, and more on the way.

خصوصی رپورٹ: Many More Hurdles In Heterogeneous Integration

آئی سی ٹو پیکج کے ڈیزائن، عمل کی توسیع، اور بہتر وشوسنییتا کے لیے مزید وسائل کی ضرورت ہوگی۔

NIST added a new vulnerability that could impact generative AI security in data centers.  (CVE-2023-4969): “A GPU kernel can read sensitive data from another GPU kernel (even from another user or app) through an optimized GPU memory region called _local memory_ on various architectures.” Security firm Trails of Bits provides more یہاں تفصیلات.

مزید خبروں کے لیے فوری لنکس:

 مینوفیکچرنگ اور ٹیسٹ
ڈیزائن اور پاور
سلامتی
آٹوموٹو اور بیٹریاں
وسیع کمپیوٹنگ اور اے آئی
گہرائی سے رپورٹس
تقریبات

مینوفیکچرنگ اور ٹیسٹ

proteanTecs uncorked a power reduction solution for the data center, mobile, communications and automotive markets. The new solution uses on-chip telemetry, coupled with machine learning and predictive analytics, to enable workload-aware reduction in power. The approach also reduces the amount of guard-banding needed inside a chip or package, which can have a big impact on power and cooling costs in data centers.

بدعت میں جاری a panel-level packaging inspection and metrology process control system aimed at buried defects and voids, targeting upcoming glass and copper-clad laminates (CCLs).

کلیدی مقام and researchers from France’s Centre national de la recherche scientifique (CNRS), Lille University، اور آسکا یونیورسٹی توڑ دیا 1Tbps barrier using a system built with a combination of terahertz photodiodes and an electronics-based receiver covering a range of 500-724 GHz.

TSMC and the Industrial Technology Research Institute (آئی ٹی آر آئی) شمولیت اختیار فورسز to research and develop a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.

Foxconn اور ایچ سی ایل گروپ announced plans for a new OSAT facility in India, reports Reuters.

امکور اور عالمی فاؤنڈیشن kicked off their European partnership with a ribbon cutting رسم at Amkor’s Porto, Portugal, facility. GF transferred 50 tools from its site in Dresden, Germany, to Porto.

Engineering and technology group Accuron Technologies حاصل RECIF Technologies, a France-based company specializing in the design, manufacture, and installation of robotic handling equipment for semiconductor wafer-handling.

Neways مکمل حصول of Netherlands-based Sencio that specializes in advanced packaging for smart sensing and actuation applications.

Natcast, the expected operator of the CHIPS for America National Semiconductor Technology Center (NSTC), کا اعلان کیا ہے کہ Synopsys' Deirdre Hanford will serve as the organization’s first chief executive officer.

اوپر کی کہانی: Navigating Heat In Advanced Packaging

New approaches and materials being explored as chip industry pushes into heterogeneous integration.

ڈیزائن اور پاور

Cadence سے بے نقاب several new apps for its Palladium Z2 emulation system — a four-state emulation app to accelerate simulations requiring X-propagation, such as for low-power verification of complex SoCs with multiple switched power domains; a real-number modeling app for simulations on mixed-signal designs; and a dynamic power analysis app with a massively parallel architecture for multi-billion-gate, million-clock-cycle power analysis of complex SoCs.

انفوسس, which provides engineering services and consulting, will حاصل InSemi Technology, a provider of semiconductor design and embedded software development services. The acquisition is expected to close during Infosys’ fiscal Q4.

نوکیا کی منصوبہ بندی to invest €360 million (~$391 million) in software, hardware, and chip design at two German sites. The move is part of a four-year European IPCEI project, focused on the integrated development of software and high-performance SoCs for radio and optical products in future mobile communications systems based on the 5G-Advanced and 6G standards.

NVM ایکسپریس متعارف a standardized, vendor-neutral framework for connecting applications to NVMe Computational Storage devices across both compute and storage services.

OIF شائع a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach. It specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect, with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range of 36 Gsym/s to 58 Gsym/s.

این سیلیکا شامل کیا post-quantum cryptography accelerators to its eSi-Crypto range of hardware accelerator IP, covering the CRYSTALS Dilithium digital signature algorithm and Kyber key encapsulation mechanism.

کوئرا کمپیوٹنگ اور آسٹریلیا کا پاوسی سپر کمپیوٹنگ ریسرچ سینٹر گے تعاون on high-performance quantum emulation software optimized for Pawsey’s Setonix supercomputer to aid in research projects focused on quantum science and technology.

The Finnish Quantum Flagship (FQF) project شروع with €13 million (~$14.2 million) from the Research Council of Finland, aiming to boost research in quantum materials, devices, and information and support commercial applications and technology transfer.

Argonne نیشنل لیبارٹری، شکاگو یونیورسٹی, and their partners collaborated to boost understanding of کمانٹم کمپیوٹنگ for financial applications.

سلامتی

نیشنل انسٹی ٹیوٹ آف اسٹینڈرڈز اینڈ ٹیکنالوجی (NIST) updated a publication offering guidance on how organizations can measure the effectiveness of their سائبرسیکیوریٹی پروگرام, and is soliciting public comments by March 18, 2024.

Security threats to multi-tenant FPGAs are growing, according to researchers at EPFL, Cyber-Defence Campus (Switzerland), and شمال مغربی پولی ٹیکنیکل یونیورسٹی (China) who analyzed “the combined threat of FPGA power wasters and satisfiability don’t-care hardware Trojans in shared-cloud FPGAs.”

A novel module-level configuration methodology for programmable camouflaged logic can be implemented without additional hardware ports and with negligible resources, according to researchers at Tsinghua University, Pennsylvania State University, North Dakota State University, and University of Notre Dame.

محققین نیویارک یونیورسٹی ابو ظہبی ایک بنایا ML analysis and attack framework of tools on certain memristor-based physical unclonable functions (MR-PUF).

Researchers from MIT’s Computer Science and Artificial Intelligence Laboratory (MIT-CSAIL) found that “ambient light sensors are vulnerable to privacy threats when embedded on a smart device’s screen.”

اوپنائی کے ساتھ کام کر رہا ہے۔ امریکی محکمہ دفاع on AI tools, including open-source سائبرسیکیوریٹی ٹولز, and revised its policy page to no longer ban the use of its technology in military activity, reports CNBC.

گوگل’s Threat Analysis Group (TAG) observed that the روسی دھمکی گروپ, COLDRIVER, has gone “beyond phishing for credentials, to delivering malware via campaigns using PDFs as lure documents.”

سائبر سیکیورٹی اور انفراسٹرکچر سیکیورٹی ایجنسی (سی آئی ایس اے) اور فیڈرل بیورو آف انویسٹی گیشن (ایف بی آئی) advised of Androxgh0st Malware, which establishes a botnet for victim identification and exploitation in vulnerable networks, and released cybersecurity guidance on Chinese-manufactured بغیر پائلٹ ہوائی جہاز کے نظام (UAS) سی آئی ایس اے جاری کیا other alerts, as well, including an مشاورتی بارہ ڈروپل کور

آٹوموٹو اور بیٹریاں

۔ امریکی حکومت awarded nearly $150 million to 24 recipients in 20 states to make existing electric vehicle (EV) بنیادی ڈھانچہ چارج more reliable. In sub-zero temperatures in Chicago, EV drivers found some charging stations either didn’t work, or charging took much longer. Many cars had to be towed away, according to CBS.

گلوبل connected car sales rose 28% year over year in Q3 2023, and two-thirds of cars sold had embedded connectivity, according to Counterpoint. China had the most connected car sales, at 33%, then the U.S. and Europe. The three regions captured 75% of the market.

BYD شروع its AI-powered smart car system, obtained a conditional testing license for L3 autonomous driving, and will invest 5 billion yuan ($701.8 million) to build all-terrain professional test drive sites in Chinese cities, reports CNBC.

Infineon شراکت دار ساتھ OMRON Social Solutions to combine Infineon’s gallium nitride (GaN) based power solutions with OMRON’s circuit topology and control technology, enabling one of Japan’s smallest and lightest vehicle-to-everything (V2X) charging systems and driving innovation towards wide bandgap materials in power supplies. Also, Infineon’s TRAVEO T2G Cluster automotive microcontrollers are now available with Finland-based کیوئٹ گروپکی گرافکس حل and its developer toolkit for building graphical user interfaces (GUI).

مزدا گے اپنانے Tesla’s North American Charging Standard (NACS) for its battery electric vehicles (BEVs) launched in North America from 2025.

چین پر مبنی Betavolt ایک تیار ایٹمی بیٹری with a 50-year life span, using nickel-63, decay technology, and diamond semiconductors to miniaturize, modularize, and reduce costs of atomic energy batteries, reports China Daily. (See تصویر.)

وسیع کمپیوٹنگ اور اے آئی

Renesas introduced a 64-bit general-purpose MPU for IoT edge and gateway devices, offering low power, fast startup, a PCI Express interface for high-speed 5G, and tamper detection. The company also debuted a dual-core Bluetooth low energy SoC with integrated flash, aimed at connected medical, asset tracking, and human interface devices.

گلوبل پی سی کی ترسیل ended Q4 2023 with a 0.2% year over year decline, and saw a 14% YoY decline for all of 2023, reports Counterpoint. Shipment momentum is expected to grow in the first half of 2024. انٹیل اور AMD have CPU solutions, Meteor Lake and Hawk Point, for next-gen AI PCs, which should drive demand.

عالمی AI server market, including AI training and inference, is expected to exceed 1.6 million units in 2024, at a growth rate of 40%, reports TrendForce, as edge AI applications shift toward AI PCs. And shipments of ایپلکی وژن پرو could reach up to 600,000 units in 2024, expanding the virtual head-mounted device market.

ایک دیلوئے survey, three-quarters of respondents expect Gen AI to transform their organizations within three years. A quarter believe their organizations are well prepared to address governance and risk issues, and more than half are concerned that widespread use of Gen AI will increase economic inequality.

پر عالمی اقتصادی فورم 2024 in Davos:

  • ۔ اقوام متحدہ Secretary-General said “every new iteration of generative AI increases the risk of serious unintended consequences” and “some powerful tech companies are already pursuing profits with a clear disregard for human rights, personal privacy, and social impact.”
  • سوئس وفاقی محکمہ خارجہ, EPFL, ETH زیورخ, and partners launched the International Computation and AI Network (ICAIN) to develop AI technologies that benefit society as a whole and help reduce global inequality.
  • اوپنائی سی ای او سیم آلٹ مین بات چیت on the future of AI.

رکن کی یونیورسٹی اور اوپنائی partnered to bring the capabilities of چیٹ جی پی ٹی Enterprise into higher education, enhancing learning, creativity, and student outcomes.

۔ ڈچ حکومت پیش کیا a vision of GenAI and announced €204.5 million (~$222 million) to the AINEd program for knowledge, innovation and the application of Dutch AI systems.

Infineon ایک آغاز magnetic position sensor housed in a small six-ball wafer-level package, suited for zoom lenses and focus adjustment in cameras, and a secondary-side controlled ZVS flyback converter chipset ideal for USB-C adapters, chargers, and travel adapters.

Infineon’s Imagimob updated its studio so users can visualize ML modeling workflows and leverage advanced capabilities to develop edge device models better and faster.

تصویر 1: Imagimob Studio’s new Graph UX. Source: Infineon

siemens ڈاؤن لوڈ، منسلک its Teamcenter Product Lifecycle Management (PLM) with Salesforce’s manufacturing and service clouds. The AI-based SaaS integration will help manufacturers build feedback loops between service execution and product development to foster innovation. And REJOOL adopted Siemens’ Xcelerator as a Service portfolio of industry software to help bring its PIONYR hydrogen compression technology to market.

Drone delivery company ونگ، کی ملکیت گوگلوالدین کی کمپنی الفابیٹ, launched a new aircraft with a range of 12 miles, cruising speed of 65 miles per hour, and the ability to carry a 5-pound delivery box.

سائنسدانوں سے واگنگن یونیورسٹی, ایم ائی ٹی, ییل یونیورسٹی، اور Jülich Research Center developed METEOR, a chameleon application that can train AI algorithms to classify objects in satellite images faster.

A new manufacturing approach for thin-film electrodes allows minimally invasive, high-res recording up to four inches inside the human brain. The monolithic probes are customizable and scalable due to thin-film technology derived from the semiconductor and digital-display screen industries, according to researchers at the کیلیفورنیا سان ڈیاگو یونیورسٹی.

گہرائی سے رپورٹس

Here are more new stories by the Semiconductor Engineering team:

Expert discussion: Which data works best for voltage droop simulation?

3D integration supports کمپیوٹ ان میموری’s versatility and accuracy, but new approaches are needed.

Reducing Power In ڈیٹا سینٹرز: New approaches to improving utilization while reducing guard-banding (video).

تقریبات

آنے والی چپ انڈسٹری تلاش کریں۔ events here:

واقعہ تاریخ جگہ
آٹوموٹو ورلڈ: ایڈوانسڈ آٹو موٹیو ٹیکنالوجی شو جنوری 24 - 26 ٹوکیو، جاپان
رفتار، پروٹوکول اور سیکورٹی: نئے آٹوموٹو نیٹ ورک چیلنجز جنوری 24 نووی ، MI
SPIE فوٹوونکس ویسٹ 27 جنوری۔ 1 فروری سان فرانسسکو، CA
DesignCon 2024 30 جنوری۔ 1 فروری سانتا کلاارا، CA
چپلیٹ سمٹ 6 تا 8 فروری سانتا کلاارا، CA
فوٹوونک کمپیوٹنگ کا عروج 7 تا 8 فروری سان جوز، CA
ویفر لیول پیکیجنگ سمپوزیم 13 تا 15 فروری حیات ریجنسی سان فرانسسکو ایئرپورٹ
2024 IEEE انٹرنیشنل سالڈ اسٹیٹ سرکٹس کانفرنس (ISSCC) 18 فروری۔ 22 فروری سان فرانسسکو، CA
PCI-SIG ڈویلپرز کانفرنس 19 فروری۔ 20 فروری تائی پے، تائیوان
Phil Kaufman Award and Banquet فروری 22 سان جوز، CA
SPIE ایڈوانسڈ لتھوگرافی + پیٹرننگ 25 فروری۔ 29 فروری San Jose, CA
Renesas Tech Day UK فروری 27 کیمبرج، برطانیہ
تمام آنے والے واقعات

آنے والے ویبینرز ہیں۔ یہاں، including talks on Cyber Trust Mark, debug and verification management, and EM simulation.

مزید پڑھنا اور نیوز لیٹرز

تازہ ترین پڑھیں خصوصی رپورٹس اور اہم خبریں۔، یا تازہ ترین چیک کریں۔ خبرنامے:

سسٹمز اور ڈیزائن
کم طاقت-اعلی کارکردگی
ٹیسٹ، پیمائش اور تجزیات
مینوفیکچرنگ، پیکجنگ اور مواد
آٹوموٹو، سیکورٹی اور وسیع کمپیوٹنگ

ٹائم اسٹیمپ:

سے زیادہ سیمی انجینئرنگ