More data requires more processing and more storage, because that data needs to be stored somewhere. What’s changing is that it’s no longer just about SRAM and DRAM. Today, multiple types of DRAM are used in the same devices, each with its own set of tradeoffs. C.S. Lin, marketing executive at Winbond, talks about the potential problems that causes, including mismatches in latency, and higher demands for throughput and lower power in domain-specific designs.
[embedded content]
- SEO Powered Content & PR Distribution. Get Amplified Today.
- PlatoData.Network Vertical Generative Ai. Empower Yourself. Access Here.
- PlatoAiStream. Web3 Intelligence. Knowledge Amplified. Access Here.
- PlatoESG. Carbon, CleanTech, Energy, Environment, Solar, Waste Management. Access Here.
- PlatoHealth. Biotech and Clinical Trials Intelligence. Access Here.
- Source: https://semiengineering.com/whats-changing-in-dram-2/
- :is
- 27
- 66
- 80
- About
- All
- All Posts
- alternative
- and
- ARE
- At
- BE
- because
- causes
- changing
- chief
- content
- data
- demands
- designs
- Devices
- each
- editor
- embedded
- Engineering
- executive
- For
- higher
- HTTPS
- in
- Including
- ITS
- jpg
- just
- Latency
- lin
- longer
- lower
- Marketing
- more
- multiple
- needs
- no
- of
- own
- plato
- Plato Data Intelligence
- PlatoData
- Posts
- potential
- power
- problems
- processing
- requires
- s
- same
- semiconductor
- set
- somewhere
- storage
- stored
- Talks
- text
- that
- The
- throughput
- thumbnail
- to
- today
- tradeoffs
- types
- used
- with
- youtube
- zephyrnet
More from Semi Engineering
Requirements For The Efficient Implementation Of AI Solutions On Edge Devices
Source Node: 3019779
Time Stamp: Dec 14, 2023
Automotive Safety: Having The Right Product Portfolio In Place
Source Node: 1868030
Time Stamp: Jan 4, 2023
Framework To Compile Quantum Programs Onto Chiplets (UCSB, Cisco)
Source Node: 2697878
Time Stamp: Jun 3, 2023
