台积电嘲笑英特尔，声称未来几年将拥有卓越的芯片技术

TSMC has delivered a hefty smackdown to Intel, claiming that its current 3nm chip production technology is as good as Intel’s plans for its 18A process in 2025.

说起在 最近的公司财报电话会议 与投资者（通过 汤姆的硬件), TSMC CEO C.C. Wei said, “our internal assessment shows that our N3P technology demonstrated comparable PPA to 18A, my competitors’ technology.”

To decode that, “PPA” stands for Power Performance Area, indicating the three critical measures of chip achievement, namely how much power a chip uses, how much performance it delivers, and how small TSMC can make it. “N3P”, meanwhile, is one of several 3nm-class production nodes TSMC currently offers. Apple is already selling iPhones containing chips based on another 3nm-class TSMC node, known as N3B. “18A” meanwhile is Intel’s next-but-two node, due in 2025.

Intel目前销售基于Intel 7节点的CPU，例如 最新的 Raptor Lake 刷新 CPU，英特尔 4 即将推出 Meteor Lake 移动 CPU 英特尔 20A 将于 2024 年推出。英特尔表示，18A（20A 的改进版）将于 2025 年推出，届时英特尔首席执行官帕特·基辛格 (Pat Gelsinger) 声称英特尔将 regained “unquestioned leadership” 在芯片生产技术方面。

嗯，根据台积电的说法，情况并非如此，台积电认为其现有的芯片生产与英特尔 2025 年的计划一样先进。让比较变得稍微复杂的是，英特尔对其 20A 节点有一些相当奇特的计划，最引人注目的是一个称为背面供电的功能，该功能据说可以实现更大的晶体管密度。

TSMC isn’t planning to add backside power delivery until its second-iteration 2nm-class node in 2026, some two years after Intel. That will no doubt allow Intel to claim that it has, indeed, regained leadership. From a certain point of view.

Of course, C.C. Wei also said during the earnings call that TSMC’s 2nm technology would be superior to Intel 18A when it arrives in 2025, even without backside power delivery. So, both companies are positioning themselves as the clear market leader.

总体而言，未来几年，台积电和英特尔之间似乎将主观判断谁拥有最先进的生产技术。事实很可能是，这两家公司最终都可能会声称自己处于领先地位，具体取决于您喜欢的措施。

但好消息是，两家公司似乎都对他们能够继续推进芯片制造技术充满信心，这意味着我们的个人电脑的比特速度将越来越快。哪个才是最重要的，对吧？

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• Sumber: https://www.pcgamer.com/tsmc-taunts-intel-claims-superior-chip-tech-for-years-to-come