Ashwini Vaishnaw 对半导体工厂的建设将很快完成充满信心，并补充说第一批本土微芯片预计将于 2024 年 8,30,000 月推出。 Ashwini Vaishnaw 表示，电子行业已扩大到价值 XNUMX 亿卢比
新德里： Union Minister for Electronics and Information Technology, Ashwini Vaishnaw, on Saturday said the “Bhoomi Pujan” (ground breaking ceremony) for the country’s first semiconductor plant has taken place in Gujarat.
The ground-breaking for the country’s first semi-conductor plant marks a pivotal moment in carrying forward Prime Minister Narendra Modi’s vision for a self-reliant India.
Vaishnaw 先生对半导体工厂的建设将很快完成充满信心，并补充说第一批本土微芯片预计将于 2024 年 XNUMX 月推出。
“Today ‘Bhoomi Pujan’ of the first semiconductor plant was conducted. This is an important step in carrying forward the PM’s vision (of Atmanirbhar Bharat). The construction of the plant will be completed soon and the first indigenous microchips will roll out from here by December 2024,” Mr Vaishnaw said.
Underlining the strides marked by the country’s electronic industry under the leadership of PM Modi, Mr Vaishnaw said, “In 2014, the manufacturing cost of mobile phones in India was ₹ 17,000 crores. This has now soared to ₹ 3,65,000 crores. The electronics industry, once valued at ₹ 1,90,000 crores, has expanded to be worth ₹ 8,30,000 crores.”
“Exports have increased fivefold, rising from ₹ 40,000 crores to ₹ 2,00,000 crores,” the Union Minister added.
维什诺表示，所有这些进步都归功于半导体芯片，并补充说该国已准备好成为主要的半导体中心。
该半导体任务于 2021 年 XNUMX 月启动，旨在将印度定位为半导​​体技术的重要参与者。
根据这一愿景，22月825日，全球半导体巨头美光宣布计划投资XNUMX亿美元在古吉拉特邦建设新的封装和测试工厂。
The facility, set to meet both domestic and international demand, is strategically located in the Sanand Industrial Park, Gujarat Industrial Development Corporation (GIDC), benefiting from Gujarat’s robust manufacturing infrastructure, favourable business environment, and skilled talent pool.
This move reinforces India’s commitment to self-reliance and its growing stature in the global semiconductor landscape, aligning with Prime Minister Modi’s vision for a technologically advanced and self-sufficient India.

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