- Published: January 2024.
- Pagini: 330
- Tabele: 22
- Cifre: 25
- Serie: Componente electronice
The global landscape of semiconductor manufacturing is rapidly evolving, with advanced packaging emerging as a critical component of manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. Advanced packaging allows for the creation of faster, cost-effective systems by integrating various chips, a technique that’s increasingly essential given the physical limitations of traditional chip miniaturization. It is reshaping the industry, enabling the integration of diverse chip types and enhancing processing speeds.
The U.S. government recognizes the importance of advanced packaging and has introduced a $3 billion National Advanced Packaging Manufacturing Program aimed at establishing high-volume packaging facilities by the end of the decade. The focus on packaging complements the existing efforts under the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.
The Global Market for Advanced Semiconductor Packaging 2024-2035 provides a comprehensive analysis of the global advanced semiconductor packaging technologies market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values in the billions (USD) by type, region, and end-use application.
Trends analyzed include heterogeneous integration, interconnects, thermal solutions, miniaturization, supply chain maturity, simulation/data analytics. Leading companies profiled include TSMC, Samsung, Intel, JCET, Amkor. Applications covered include AI, mobile, automotive, aerospace, IoT, communications (5G/6G), high performance computing, medical, and consumer electronics.
Regional markets explored include North America, Asia Pacific, Europe, China, Japan, and RoW. The report also assesses drivers like ML/AI, data centers, EV/ADAS; challenges like costs, complexity, reliability; emerging approaches like system-in-package, monolithic 3D ICs, advanced substrates, novel materials. Overall an in-depth benchmark analysis of the opportunities within the advancing semiconductor packaging industry.
Conținutul raportului include:
- Market size and forecasts
- Key technology trends
- Growth drivers and challenges
- Analiza competitivă a peisajului
- Future packaging trends outlook
- In-depth analysis of wafer level packaging (WLP)
- System-in-Package (SiP) and heterogeneous integration
- Monolithic 3D ICs overview
- Advanced semiconductor packaging applications across key markets: AI, mobile, automotive, aerospace, IoT, communications, HPC, medical, consumer electronics
- Regional market breakdown
- Assessment of key industry challenges: complexity, costs, supply chain maturity, standards
- Company profiles: Strategies and technologies of 90 key players. Companies profiled include 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Corporation, Leader-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Box, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Company (TSMC) and Yuehai Integrated.
1 METODOLOGIA CERCETĂRII 14
2 REZUMAT 15
- 2.1 Semiconductor Packaging Technology Overview 16
- 2.1.1 Conventional packaging approaches 19
- 2.1.2 Advanced packaging approaches 20
- 2.2 Semiconductor Supply Chain 22
- 2.3 Key Technology Trends in Advanced Packaging 22
- 2.4 Market Size and Growth Projections (Billions USD) 24
- 2.4.1 By packaging type 24
- 2.4.2 După piață 26
- 2.4.3 După regiune 28
- 2.5 Market Growth Drivers 30
- 2.6 Competitive Landscape 32
- 2.7 Market Challenges 34
- 2.8 Știri și investiții recente ale pieței 36
- 2.9 Future outlook 38
- 2.9.1 Heterogeneous Integration 39
- 2.9.2 Chiplets and Die Disaggregation 41
- 2.9.3 Advanced Interconnects 43
- 2.9.4 Scaling and Miniaturization 45
- 2.9.5 Thermal Management 47
- 2.9.6 Materials Innovation 48
- 2.9.7 Supply Chain Developments 50
- 2.9.8 Role of Simulation and Data Analytics 52
3 SEMICONDUCTOR PACKAGING TECHNOLOGIES 58
- 3.1 Transistor Device Scaling 58
- 3.1.1 Prezentare generală 58
- 3.2 Wafer Level Packaging 61
- 3.3 Fan-Out Wafer Level Packaging 62
- 3.4 Chiplets 64
- 3.5 Interconnection in Semiconductor Packaging 67
- 3.5.1 Prezentare generală 67
- 3.5.2 Wire bonding 67
- 3.5.3 Flip-chip bonding 69
- 3.5.4 Through-silicon via (TSV) bonding 72
- 3.5.5 Hybrid bonding with chiplets 73
- 3.6 2.5D and 3D Packaging 75
- 3.6.1 2.5D packaging 75
- 3.6.1.1 Prezentare generală 76
- 3.6.1.1.1 2.5D vs. 3D Packaging 76
- 3.6.1.2 Benefits 77
- 3.6.1.3 Provocări 79
- 3.6.1.4 Tendințe 80
- 3.6.1.5 Jucătorii de pe piață 81
- 3.6.1.6 2.5D Organic-based packaging 83
- 3.6.1.7 2.5D glass-based packaging 84
- 3.6.1.1 Prezentare generală 76
- 3.6.2 3D packaging 88
- 3.6.2.1 Benefits 89
- 3.6.2.2 Provocări 92
- 3.6.2.3 Tendințe 94
- 3.6.2.4 Embedded Si bridges 96
- 3.6.2.5 Si interposer 97
- 3.6.2.6 3D Hybrid bonding 98
- 3.6.2.7 Jucătorii de pe piață 98
- 3.6.1 2.5D packaging 75
- 3.7 Flip Chip Packaging 102
- 3.8 Embedded Die Packaging 104
- 3.9 Trends in Advanced Packaging 106
- 3.10 Packaging Roadmap 108
4 WAFER-LEVEL PACKAGING 111
- 4.1 Introducere 111
- 4.2 Benefits 112
- 4.3 Types of Wafer Level Packaging 113
- 4.3.1 Wafer Level Chip Scale Packaging 114
- 4.3.1.1 Prezentare generală 114
- 4.3.1.2 Avantaje 114
- 4.3.1.3 Aplicații 115
- 4.3.2 Fan-Out Wafer Level Packaging 117
- 4.3.2.1 Prezentare generală 117
- 4.3.2.2 Avantaje 117
- 4.3.2.3 Aplicații 119
- 4.3.3 Wafer Level Fan-Out Packaging 120
- 4.3.3.1 Prezentare generală 120
- 4.3.3.2 Benefits 121
- 4.3.3.3 Aplicații 122
- 4.3.4 Other Types of WLP 123
- 4.3.1 Wafer Level Chip Scale Packaging 114
- 4.4 WLP Manufacturing Processes 124
- 4.4.1 Wafer Preparation 124
- 4.4.2 RDL Buildup 125
- 4.4.3 Bumping 126
- 4.4.4 Encapsulation 127
- 4.4.5 Integration 128
- 4.4.6 Test and Singulation 129
- 4.5 Wafer Level Packaging Trends 131
- 4.6 Applications of Wafer Level Packaging 133
- 4.6.1 Mobile and Consumer Electronics 133
- 4.6.2 Automotive Electronics 134
- 4.6.3 IoT and Industrial 135
- 4.6.4 High Performance Computing 136
- 4.6.5 Aerospace and Defense 137
- 4.7 Wafer Level Packaging Outlook 138
5 SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION 139
- 5.1 Introducere 139
- 5.2 Approaches for heterogenous integration 141
- 5.3 SiP Manufacturing Approaches 142
- 5.3.1 2.5D Integrated Interposers 143
- 5.3.2 Multi-Chip Modules 145
- 5.3.3 3D Stacked packages 146
- 5.3.4 Fan-Out Wafer Level Packaging 149
- 5.3.5 Flip Chip Package-on-Package 150
- 5.4 SiP Component Integration 152
- 5.5 Heterogeneous Integration Drivers 154
- 5.6 Trends Driving SiP Adoption 155
- 5.7 SiP Applications 156
- 5.8 SiP Industry Landscape 157
- 5.9 Outlook on Heterogeneous Integration 160
6 MONOLITHIC 3D IC 162
- 6.1 Prezentare generală 162
- 6.2 Benefits 164
- 6.3 Challenges 165
- 6.4 Future outlook 166
7 PIEȚE ȘI APLICAȚII 168
- 7.1 Market value chain 168
- 7.2 Packaging trends by market 169
- 7.3 Artificial Intelligence (AI) 170
- 7.3.1 Aplicații 171
- 7.3.2 Ambalare 172
- 7.4 Mobile and Handheld Devices 172
- 7.4.1 Aplicații 173
- 7.4.2 Ambalare 173
- 7.5 High Performance Computing 175
- 7.5.1 Aplicații 175
- 7.5.2 Ambalare 176
- 7.6 Automotive Electronics 179
- 7.6.1 Aplicații 179
- 7.6.2 Ambalare 179
- 7.7 Internet of Things (IoT) Devices 180
- 7.7.1 Aplicații 181
- 7.7.2 Ambalare 181
- 7.8 5G & 6G Communications Infrastructure 182
- 7.8.1 Aplicații 182
- 7.8.2 Ambalare 182
- 7.9 Aerospace and Defense Electronics 185
- 7.9.1 Aplicații 185
- 7.9.2 Ambalare 187
- 7.10 Medical Electronics 188
- 7.10.1 Aplicații 188
- 7.10.2 Ambalare 189
- 7.11 Consumer Electronics 189
- 7.11.1 Aplicații 189
- 7.11.2 Ambalare 190
- 7.12 Global market (Units) 193
- 7.12.1 By market 193
- 7.12.2 Regional markets 196
- 7.12.2.1 Asia Pacific 197
- 7.12.2.1.1 China 198
- 7.12.2.1.2 Taiwan 199
- 7.12.2.1.3 Japan 200
- 7.12.2.1.4 South Korea 201
- 7.12.2.2 America de Nord 202
- 7.12.2.2.1 United States 203
- 7.12.2.2.2 Canada 204
- 7.12.2.2.3 Mexico 205
- 7.12.2.3 Europa 206
- 7.12.2.3.1 Germany 208
- 7.12.2.3.2 France 209
- 7.12.2.3.3 United Kingdom 210
- 7.12.2.3.4 Nordic Countries 211
- 7.12.2.4 Rest of World 212
- 7.12.2.1 Asia Pacific 197
8 MARKET PLAYERS 215
- 8.1 Integrated Device Manufacturers 215
- 8.2 Outsourced Semiconductor Assembly and Test (OSAT) Companies 217
- 8.3 Foundries 218
- 8.3.1 Semiconductor foundries technology roadmaps 218
- 8.4 Electronics OEMs 220
- 8.5 Packaging Equipment and Materials Companies 222
9 MARKET CHALLENGES 225
- 9.1 Technical Complexity 225
- 9.2 Supply Chain Maturity 226
- 9.3 Cost 227
- 9.4 Standarde 228
- 9.5 Reliability Assurance 229
10 PROFILE DE COMPANIE 230 (90 de profiluri de companie)
11 REFERINȚE 317
Lista tabelelor
- Table 1. Key Technology Trends in Advanced Packaging. 23
- Table 2. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type. 24
- Table 3. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market. 26
- Table 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region. 28
- Table 5. Market Growth Drivers for advanced semiconductor packaging. 30
- Table 6. Challenges Facing Advanced Packaging Adoption. 34
- Table 7. Recent advanced semiconductor packaging market news and investments. 36
- Table 8. Challenges in transistor scaling. 60
- Table 9. Specifications of interconnection methods. 67
- Table 10. 2.5D vs. 3D packaging. 76
- Table 11. 2.5D packaging challenges. 79
- Table 12. Market players in 2.5D packaging. 81
- Table 13. Advantages and disadvantages of 3D packaging. 88
- Table 14. Trends in Advanced Packaging. 106
- Table 15. Key trends shaping wafer level packaging. 131
- Table 16. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages. 154
- Table 17. Benefits of monolithic 3D ICs. 164
- Table 18. Challenges of monolithic 3D ICs. 165
- Table 19. Advanced semiconductor packaging market value chain. 168
- Table 20. Markets and applications for advanced semiconductor packaging. 170
- Table 21. Advanced semiconductor packaging (units), 2020-2025, by market. 193
- Table 22. Advanced semiconductor packaging (units), 2020-2025, by region. 195
Lista figurilor
- Figure 1. Timeline of different packaging technologies. 19
- Figure 2. Evolution roadmap for semiconductor packaging. 20
- Figure 3. Semiconductor Supply Chain. 22
- Figure 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type. 25
- Figure 5. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market. 26
- Figure 6. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region. 28
- Figure 7. Advanced semiconductor packaging (units), 2020-2025, by market. 56
- Figure 8. Scaling technology roadmap. 59
- Figure 9. Wafer-level chip scale packaging (WLCSP) 61
- Figure 10. Embedded wafer-level ball grid array (eWLB). 62
- Figure 11. Fan-out wafer-level packaging (FOWLP). 63
- Figure 12. Chiplet design. 64
- Figure 13. 2D chip packaging. 75
- Figure 14. 2.5D-integrated packaging on a silicon interposer. 79
- Figure 15. RDL fabrication. 79
- Figure 16. Three-die, wire-bond semiconductor assembly. 90
- Figure 17. 3D integration roadmap. 95
- Figure 18. Projected timelines for packaging and interconnects. 109
- Figure 19. Typical WLCSP structure. 114
- Figure 20. Typical FOWLP structure, 117
- Figure 21. 2.5D chiplet integration. 143
- Figure 22. Advanced semiconductor packaging (units), 2020-2025, by market. 194
- Figure 23. Advanced semiconductor packaging (units), 2020-2025, by region. 196
- Figure 24. 2.5D Molded Interposer on Substrate (MIoS) package. 291
- Figure 25. 12-layer HBM3. 297
Modalitati de plata: Visa, Mastercard, American Express, Paypal, Transfer bancar.
Pentru a cumpăra prin factură (transfer bancar), contactați info@futuremarketsinc.com sau selectați Transfer bancar (Factură) ca metodă de plată la finalizare.
- Distribuție de conținut bazat pe SEO și PR. Amplifică-te astăzi.
- PlatoData.Network Vertical Generative Ai. Împuterniciți-vă. Accesați Aici.
- PlatoAiStream. Web3 Intelligence. Cunoștințe amplificate. Accesați Aici.
- PlatoESG. carbon, CleanTech, Energie, Mediu inconjurator, Solar, Managementul deșeurilor. Accesați Aici.
- PlatoHealth. Biotehnologie și Inteligență pentru studii clinice. Accesați Aici.
- Sursa: https://www.nanotechmag.com/the-global-market-for-advanced-semiconductor-packaging-2024-2035/?utm_source=rss&utm_medium=rss&utm_campaign=the-global-market-for-advanced-semiconductor-packaging-2024-2035
- :are
- :este
- $3
- 1
- 10
- 11
- 114
- 12
- 120
- 13
- 14
- 15%
- 16
- 17
- 179
- 180
- 19
- 20
- 202
- 2024
- 22
- 23
- 24
- 25
- 2D
- 3d
- 58
- 5G
- 67
- 6G
- 7
- 75
- 8
- 9
- 90
- a
- peste
- act
- activ
- Adoptare
- avansat
- înaintând
- Avantajele
- Industria aerospațială
- AI
- vizează
- TOATE
- permite
- de asemenea
- America
- american
- american Express
- an
- analiză
- Google Analytics
- analizate
- analiza
- și
- aplicație
- aplicatii
- abordari
- Mulțime
- artificial
- inteligență artificială
- AS
- Asia
- Asia Pacific
- Asamblare
- evaluează
- At
- auto
- bilă
- Bancă
- prin transfer bancar
- de bază
- Benchmark
- Beneficiile
- Miliard
- miliarde
- Cutie
- by
- Canada
- Centre
- lanţ
- provocări
- Finalizeaza comanda
- China
- cip
- Chips
- Comunicații
- Companii
- companie
- competitiv
- complexitate
- component
- cuprinzător
- tehnica de calcul
- consumator
- Electronice de consum
- conținut
- convențional
- Corp
- CORPORAȚIE
- A costat
- cost-eficiente
- Cheltuieli
- acoperit
- creaţie
- critic
- de date
- centre de date
- deceniu
- Apărare
- Amenajări
- dispozitiv
- Dispozitive
- .
- diferit
- diferit
- drivere
- conducere
- Eforturile
- Componente electronice
- încorporat
- șmirghel
- subliniind
- permițând
- , acoperă
- capăt
- consolidarea
- echipament
- esenţial
- stabilirea
- Eter (ETH)
- Europa
- evoluţie
- evoluție
- executiv
- existent
- explorat
- expres
- facilități
- cu care se confruntă
- factori
- mai repede
- Flip
- Concentra
- Pentru
- din
- funcționalitate
- viitor
- dat
- Caritate
- piata globala
- Guvern
- Grilă
- Creștere
- Înalt
- High Performance Computing
- hpc
- HTTPS
- Hibrid
- ICS
- importanță
- in
- în profunzime
- include
- tot mai mult
- industrie
- integrate
- integrarea
- integrare
- Intel
- Inteligență
- interconectare
- interconectare
- interconexiuni
- Internet
- internetul Lucrurilor
- introdus
- Investiții
- factură
- IoT
- IT
- ianuarie
- Japonia
- jpg
- Cheie
- peisaj
- conducere
- Nivel
- ca
- limitări
- Macro
- de fabricaţie
- Piață
- Stiri de piata
- valoare de piață
- Valorile de piata
- pieţe
- Mastercard
- Materiale
- scadență
- medical
- metodă
- Metode
- Mexic
- micro
- Mobil
- Monolitic
- național
- ştiri
- North
- America de Nord
- roman
- of
- on
- Oportunităţi
- or
- Altele
- Perspectivă
- global
- Prezentare generală
- Pacific
- pachet
- ofertele
- ambalaje
- plată
- Modalitate de plată
- PayPal
- performanță
- fizic
- Plato
- Informații despre date Platon
- PlatoData
- jucători
- putere
- prelucrare
- Profiluri
- Program
- proiectat
- proiecţiile
- furnizează
- cumpărare
- repede
- recent
- recunoaște
- regiune
- regional
- încredere
- raportează
- cercetare
- reprofilare
- REST
- foaie de parcurs
- foi de parcurs
- Rol
- RÂND
- s
- Samsung
- Scară
- scalare
- Ştiinţă
- selecta
- semiconductor
- fasonarea
- Siliciu
- simulare
- Mărimea
- soluţii
- Sud
- Specificaţii
- viteze
- stivuite
- strategii
- structura
- livra
- lanțului de aprovizionare
- sisteme
- Taiwan
- Tehnic
- tehnică
- Tehnologii
- Tehnologia
- test
- acea
- termic
- lucruri
- Prin
- cronologie
- cronologii
- tradiţional
- transfer
- Tendinţe
- tsmc
- tip
- Tipuri
- tipic
- ne
- Guvernul SUA
- în
- Unit
- de unităţi
- USD
- valoare
- Valori
- diverse
- de
- are drept scop
- vs
- Fire de sârmă
- cu
- în
- zephyrnet