Weltrend and Transphorm Partner to Launch GaN System-in-Package Solution

Time Stamp: March 6, 2023 4:01 AM
Source Node: 1995541

In the ever-evolving world of technology, two major players in the semiconductor industry have recently announced a partnership to launch a groundbreaking GaN System-in-Package (SiP) solution. Weltrend, a leading provider of power management and analog ICs, and Transphorm, an innovator in the field of Gallium Nitride (GaN) power conversion, have come together to create a new SiP solution that promises to revolutionize the industry.

The new GaN System-in-Package solution combines Weltrend's expertise in power management and analog ICs with Transphorm's GaN technology to create a highly efficient, compact, and cost-effective solution. The SiP solution is designed to enable high-performance power conversion in a wide range of applications, including consumer electronics, automotive, industrial, and medical. The solution is also designed to reduce the size and cost of power conversion systems while increasing their efficiency.

The SiP solution utilizes Transphorm's GaN technology to create a highly efficient power conversion system that is capable of delivering up to 95% efficiency. This high efficiency allows for greater power density and smaller form factors, which can help reduce the size and cost of power conversion systems. Additionally, the SiP solution is designed to provide superior thermal performance, which can help reduce system temperatures and improve system reliability.

The partnership between Weltrend and Transphorm has created a powerful new SiP solution that promises to revolutionize the power conversion industry. The highly efficient, compact, and cost-effective solution is designed to enable high-performance power conversion in a wide range of applications. With its superior thermal performance and high efficiency, the SiP solution is sure to be a game-changer in the industry.

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