Room-Temperature Surface-Activated Atomic Layer Deposition of Aluminium Oxide for Bonding

Applications

Room-temperature surface-activated atomic layer deposition (ALD) of aluminium oxide is a versatile and cost-effective method for bonding applications. ALD is a chemical vapor deposition (CVD) technique that uses sequential, self-limiting surface reactions to deposit thin films of materials. It is a versatile process that can be used to deposit a variety of materials, including metals, oxides, and polymers.

The ALD process begins with a substrate, such as a silicon wafer, which is placed in an ALD chamber. The chamber is then filled with a precursor gas, such as trimethylaluminium (TMA), and the substrate is exposed to the gas. The TMA molecules react with the substrate surface and form a monolayer of aluminium oxide. This process is repeated until the desired thickness of the film is achieved.

One of the advantages of using ALD for bonding applications is that it can be done at room temperature. This eliminates the need for high temperatures, which can damage sensitive components. Additionally, ALD can be used to deposit materials with high conformality and uniformity. This makes it ideal for applications where precise thickness control is required.

ALD also offers excellent adhesion properties, which makes it suitable for bonding applications. ALD-deposited aluminium oxide films have been shown to have excellent adhesion to a variety of substrates, including glass, silicon, and metals. This makes it an ideal choice for bonding applications, such as the joining of two substrates together.

In addition to its excellent adhesion properties, ALD-deposited aluminium oxide films also offer excellent corrosion resistance. This makes them ideal for use in harsh environments, such as those found in automotive and aerospace applications.

Overall, ALD-deposited aluminium oxide films are an excellent choice for bonding applications due to their excellent adhesion properties, uniformity, and corrosion resistance. They are easy to use and can be done at room temperature, making them an ideal choice for a variety of bonding applications.

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