New i-ToF imager enables small 3D camera systems with improved quantum efficiency at optimised cost

Munich, Germany. 24 February 2023 – Infineon Technologies AG, in collaboration with 3D time-of-flight partner pmdtechnologies, has introduced the IRS2976C Time of Flight (ToF) VGA sensor, a performance-enhancing evolution of the IRS2877C ToF VGA sensor and novel member of the REAL3 product family.

The implementation of Infineon’s advanced pixel technology enables the pixels to achieve a quantum efficiency of 30% and more, a level so far only attained by back-side illumination (BSI) sensors. Remarkably, this is accomplished while maintaining the superior cost advantage of front-side illumination (FSI) sensors. As a result, the IRS2976C sensor is the ToF imager in the world to pass Googles Class 3 (Strong) certification for face ID, while operating under the mobile device’s display.

The IRS2976C imager supports a number of long-range, low-power use cases that enable a measurement range of 10 meter and further. As with all members of the REAL3 family, pmdtechnologies’ patented Suppression of Background Illumination (SBI) technology is integrated into each pixel. This provides the data in high dynamic range (HDR) and sunlight scenes.

“Our ToF CMOS process ensures excellent sensitivity and operation in indoor and outdoor environments,” says Christian Herzum, vice president 3D-sensing at Infineon. “In addition, our IRS2976C 3D ToF imager offers a high level of functionality and maximum flexibility to optimise 3D camera designs. The sensor is ideal for applications like secure authentication for smartphones, payment terminals, smart door locks and also for virtual and augmented reality (AR/VR) headsets, service robots, and various IoT devices.”

The IRS2976C offers system VGA resolution of 640 x 480 depth points. With the small form factor of 23 mm², the imager sensor is drop-in compatible to previous IRS2877C imager and allows an easy upgrade path. The high level of integration enables a reduced bill of material (BOM), lowest form factors and simplified design. In combination with IRS9102C, Infineon’s latest VCSEL driver, the new IRS2976C allows the design of the small 3D camera systems at optimised costs.

Availability

Engineering samples of the IRS2976C imager are available. The new product will be presented at Mobile World Congress 2023 in Barcelona, Spain.

More information is available at here.

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