Infineon Signs Multi-year Agreement To Supply Power Semiconductors To Hyundai/Kia

Republished By Plato

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18 October 2023

Infineon Technologies AG has signed a multi-year agreement to build and reserve manufacturing capacity to supply silicon carbide (SiC) as well as silicon (Si) power semiconductor modules and chips to South Korea-based Hyundai Motor Company and Kia Corp until 2030. Hyundai/Kia will support the capacity build-up and capacity reservation with financial contributions.

“Infineon stands as a valued strategic partner, boasting steadfast production capabilities and distinct technological prowess within the power semiconductor market,” comments Heung Soo Kim, executive VP & head of the Global Strategy Office (GSO) at Hyundai Motor Group. “This partnership not only empowers Hyundai Motor and Kia to stabilize its semiconductor supply but also positions us to solidify our leadership in the global EV market,” he adds.

“As a trusted partner, we are proud to advance our long-term partnership with Hyundai/Kia,” says Peter Schiefer, president of Infineon’s Automotive Division. “We contribute premium products of high quality, our system knowledge and application understanding combined with continued investments in manufacturing capacity to address the increasing demand for automotive power electronics.”

From left to right: Jason Chae (VP of the Semicon Strategy Group at Hyundai Motor Company), Heung Soo Kim (executive VP & head of Global Strategy Office at Hyundai Motor Group), Peter Schiefer (president of Infineon's Automotive Division), Peter Schaefer (executive VP, sales, marketing and distribution of Infineon’s Automotive Division).

Picture: From left to right: Jason Chae (VP of the Semicon Strategy Group at Hyundai Motor Company), Heung Soo Kim (executive VP & head of Global Strategy Office at Hyundai Motor Group), Peter Schiefer (president of Infineon's Automotive Division), Peter Schaefer (executive VP, sales, marketing and distribution of Infineon’s Automotive Division).

Infineon’s power semiconductors are key enablers for the transition to electro-mobility. This transition will lead to strong market growth for power semiconductors, especially those based on wide bandgap materials like SiC. With the significant expansion of its fabrication plant in Kulim, Malaysia, Infineon is building what it is reckoned will be the world’s largest 200mm SiC power fab, strengthening its role as a high-volume supplier to the automotive industry. In line with Infineon’s multi-site strategy, the Kulim facility will complement the firm’s existing manufacturing capacity in Villach, Austria, and further capacity expansions in Dresden, Germany.

See related items:

Infineon expanding Kulim fab investment with €5bn second phase for Module Three

Tags: Infineon Power electronics

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