Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. Mike Kelly, vice president of advanced packaging development and technology integration at Amkor Technology, talks about a variety of issues ranging from uneven aging, warpage, and different mechanical stresses, as well as some possible benefits.
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Ed Sperling
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Ed Sperling is the editor in chief of Semiconductor Engineering.
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