Search results for: Semiconductor

Patent Office Issued 230 Patents to Indiana Entities in December 2023

Source Node: https://www.iniplaw.org/patent-office-issued-230-patents-to-indiana-entities-in-december-2023/
Time Stamp: February 1, 2024 10:43 AM - Modified On: February 1, 2024 - Published By:
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The U.S. Patent Office issued the following 230 patents to persons and businesses in Indiana in December 2023: PATENT NUMBER                                    PATENT TITLE US 11851685 B2 Zwitterion buffer containing compositions and uses in electroanalytical devices and methods US 11850899 B2 Removable safety chain tie down apparatus US 11856182 B2 Icon-based home certification, in-home leakage testing, and antenna matching pad US 11851209 B2 Pod cover system for a vertical take-off and landing (VTOL) unmanned aerial vehicle (UAV) US 11853284 B2 In-place updates with concurrent reads in a decomposed state US 11849940 B2

Power Semiconductor Innovations Toward Green Goals

Source Node: https://www.acnnewswire.com/press-release/english/88810/
Time Stamp: February 1, 2024 2:35 AM - Modified On: February 1, 2024 - Published By:
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TAIPEI, TW, Feb 1, 2024 - (ACN Newswire) - The continuous drive toward decarbonization is fueling power semiconductor innovations—whether in terms of materials, chip design, circuit topologies, or packaging. The need to improve and enhance energy efficiency, one of the most demanding challenges of power electronics, to meet the requirements imposed by international standards and to reduce power waste, is expected to lead to more sustainable electronics products and systems. PowerUP Asia 2024 is a three-day virtual conference and exhibition highlighting the latest technology developments and trends in power electronics,

TANAKA Establishes New Method of Recovering Precious Metals Adhering to Vacuum Film Formation Equipment Components

Source Node: https://www.jcnnewswire.com/pressrelease/88725/3/
Time Stamp: January 31, 2024 2:00 PM - Modified On: January 31, 2024 - Published By:
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TOKYO, Jan 31, 2024 - (JCN Newswire) -　TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Group CEO: Koichiro Tanaka), which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a jig cleaning method called TANAKA Green Shield. This cleaning method is characterized by nickel plating on the adhesion-preventing plate[1], a component of vacuum film formation equipment[2] used in semiconductor manufacturing and other processes. When using a nickel-plated adhesion-preventing plate, PGM[3] sputtered films, including platinum and palladium, can be easily

Top 2024 Enterprise AR Trends To Watch – AREA

Source Node: https://thearea.org/top-2024-enterprise-ar-trends-to-watch/
Time Stamp: January 31, 2024 1:18 PM - Modified On: January 31, 2024 - Published By:
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As we ease out of the first month of 2024, we are now fully engaged in the new year. In the past 30 days, I’ve had an opportunity to learn from my peers, such as Tom Emrich of Niantic (trend watches on his newsletter) and the co-chair of the AREA Research Committee, Samuel Neblett of Boeing, and to reflect on the projects in which I’m involved. I’ve compressed my vague sense of hope and excitement down into a few enterprise AR trends I will be watching over the next 11

2024 Outlook with Justin Endo of Mixel – Semiwiki

Source Node: https://semiwiki.com/ip/mixel/341140-2024-outlook-with-justin-endo-of-mixel/
Time Stamp: January 31, 2024 1:00 PM - Modified On: January 31, 2024 - Published By:
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  Mixel is a semiconductor intellectual property (IP) company that we have been working with for 4 years with outstanding results.  Mixel’s focus is on developing mixed-signal IP, which includes analog and digital components. These IP cores are often used in applications such as mobile devices, consumer electronics, automotive systems, and other embedded systems where both analog and digital functions are required. The company provides a wide range of IP cores for various interfaces and standards, including MIPI cores (Mobile Industry Processor Interface),  Multi-standard IP Cores,  and LVDS (Serializer and

The 7 Largest US Funding Rounds of December 2023

Source Node: https://www.alleywatch.com/2024/01/us-startup-funding-top-largest-december-2023-vc/
Time Stamp: January 31, 2024 11:27 AM - Modified On: January 31, 2024 - Published By:
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Armed with some data from our friends at CrunchBase, I broke down the largest US startup funding rounds from December 2023. I have included some additional information such as industry, company description, round type, founders, and total equity funding raised to further the analysis. The TechWatch Media Group audience is driving progress and innovation on a global scale. With its regional media properties (NYC Tech, LA Tech, London Tech, Paris Tech, Boston Tech) TechWatch Media Group is the highway for technology and entrepreneurship. There are a number of options to

Latest issue of Semiconductor Today now available

Source Node: https://www.semiconductor-today.com/news_items/2024/jan/semiconductor-today-310124.shtml
Time Stamp: January 31, 2024 11:10 AM - Modified On: January 31, 2024 - Published By:
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31 January 2024 For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, subscribe to Semiconductor Today magazine. Published today and free of charge, Semiconductor Today’s latest issue covers all that is new in gallium arsenide (GaAs), indium phosphide (InP), nitrides, silicon carbide (SiC), silicon germanium (SiGe) and other compound semiconductor materials. The magazine also covers the devices and applications that these materials enable. Click here or issue cover for direct access Articles in this issue include:

MICLEDI demos device-ready micro-LEDs with micro-lenses at SPIE AR-VR-MR

Source Node: https://www.semiconductor-today.com/news_items/2024/jan/micledi-310124.shtml
Time Stamp: January 31, 2024 10:30 AM - Modified On: January 31, 2024 - Published By:
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News: LEDs 31 January 2024 MICLEDI Microdisplays B.V. of Leuven, Belgium — a fabless developer of micro-LED display modules for augmented reality (AR) glasses that was spun off from nanoelectronics research center IMEC in 2019 —showcased its range of red, green and blue (R, G and B) µLEDs at the SPIE AR-VR-MR 2024 exhibition in San Francisco, CA, USA (30–31 January), colocated with Photonics West 2024. The demonstrations highlighted what is claimed to be excellent color performance in each color point across the full range of drive currents. Designed for a variety of AR display appliances that

Dark solitons spotted in ring semiconductor lasers – Physics World

Source Node: https://physicsworld.com/a/dark-solitons-spotted-in-ring-semiconductor-lasers/
Time Stamp: January 31, 2024 8:01 AM - Modified On: January 31, 2024 - Published By:
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Darkness and light: dark solitons have been created in an electrically-injected laser. (Courtesy: iStock/agsandrew) Dark solitons – regions of optical extinction against bright backgrounds – have been seen spontaneously forming in ring semiconductor lasers. Made by an international team of researchers, the observation could lead to improvements in molecular spectroscopy and integrated optoelectronics. Frequency combs – pulsed lasers that output light with equally-spaced frequencies – are one of the most important achievements in the history of laser physics. Sometimes referred to as optical rulers, they are the basis of time

South Korean AI Chip Startup Rebellions Snags Funding to Challenge Nvidia

Source Node: https://www.analyticsvidhya.com/blog/2024/01/south-korean-ai-chip-startup-rebellions-snags-funding-to-challenge-nvidia/
Time Stamp: January 31, 2024 7:54 AM - Modified On: January 31, 2024 - Published By:
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South Korean AI chip startup, Rebellions Inc., has successfully secured $124 million in a recent Series B financing round, with major contributions from KT Corp. The funds will be utilized to expedite the development of Rebellions’ third AI chip, known as Rebel, designed to compete with industry leader Nvidia. The investment underscores the heightened interest in AI hardware and the competitive landscape evolving around semiconductor technologies. Also Read: Ex-Twitter CEO Parag Agrawal Secures $30M Funding for New AI Startup Series B Funding and Valuation Rebellions closed its Series B financing

Quantum News Briefs: January 31, 2024: The University of Tokyo, the National University of Seoul and the University of Chicago sign $100 million deal funded by IBM to create a quantum computing ecosystem; Korea Quantum Computing and IBM Collaborate to Bring IBM Watsonx and Quantum Computing to Korea; Aquark’s unique technique for generating cold atoms achieved by University of Birmingham; New Research Collaboration Unites Quantum Engineering and Artificial Intelligence; Wall Street Favorites: 3 Quantum Computing Stocks with Strong Buy Ratings in January 2024; and MORE! – Inside Quantum Technology

Source Node: https://www.insidequantumtechnology.com/news-archive/quantum-news-briefs-january-31-2024-the-university-of-tokyo-the-national-university-of-seoul-and-the-university-of-chicago-sign-100-million-deal-funded-by-ibm-to-create-a-quantum-computing-ecosys/
Time Stamp: January 31, 2024 6:00 AM - Modified On: January 31, 2024 - Published By:
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By Kenna Hughes-Castleberry posted 31 Jan 2024 Quantum News Briefs: January 31, 2024:  The University of Tokyo, the National University of Seoul and the University of Chicago sign $100 million deal funded by IBM to create a quantum computing ecosystem In a landmark collaboration at Davos, Switzerland, the University of Tokyo, the National University of Seoul, and the University of Chicago have partnered with IBM in a $100 million project to develop a quantum computer ecosystem over the next decade. This ambitious project aims to build a supercomputer capable of