Settimana dell'industria dei chip in rassegna

Di Jesse Allen, Gregory Haley e Liz Allan

Synopsys volere acquisire Ansis for about $35 billion in cash and stock. The deal will boost Synopsys’ multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025.

www.era.com semiconductor revenue in 2023 totaled $533 billion, a decrease of 11.1% from 2022, according to preliminary results by Gartner. The combined semiconductor revenue of the top 25 semiconductor vendors declined 14.1% in 2023, accounting for 74.4% of the market, down from 77.2% in 2022.

However, simple formulas on how the chip industry is doing no longer apply. There are too many variables, and more on the way.

NIST added a new vulnerability that could impact generative AI security in data centers.  (CVE-2023-4969): “A GPU kernel can read sensitive data from another GPU kernel (even from another user or app) through an optimized GPU memory region called _local memory_ on various architectures.” Security firm Trails of Bits provides more dettagli qui.

Collegamenti rapidi ad altre notizie:

 Produzione e test
Design e potenza
Sicurezza
Automotive e batterie
Informatica pervasiva e intelligenza artificiale
Rapporti approfonditi
Eventi

Produzione e test

proteanTec uncorked a power reduction solution for the data center, mobile, communications and automotive markets. The new solution uses on-chip telemetry, coupled with machine learning and predictive analytics, to enable workload-aware reduction in power. The approach also reduces the amount of guard-banding needed inside a chip or package, which can have a big impact on power and cooling costs in data centers.

Sull'innovazione rilasciato a panel-level packaging inspection and metrology process control system aimed at buried defects and voids, targeting upcoming glass and copper-clad laminates (CCLs).

Keysight and researchers from France’s Centre national de la recherche scientifique (CNRS), Lille Universitye Università di Osaka rotto il 1Tbps barrier using a system built with a combination of terahertz photodiodes and an electronics-based receiver covering a range of 500-724 GHz.

TSMC and the Industrial Technology Research Institute (ITRI) Forze unite to research and develop a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.

Foxconn ed Gruppo bianconero announced plans for a new OSAT facility in India, reports Reuters.

Amkor ed Fonderie globali kicked off their European partnership with a ribbon cutting cerimonia at Amkor’s Porto, Portugal, facility. GF transferred 50 tools from its site in Dresden, Germany, to Porto.

Engineering and technology group Accuron Technologies acquisito RECIF Technologies, a France-based company specializing in the design, manufacture, and installation of robotic handling equipment for semiconductor wafer-handling.

Mai completato il acquisizione of Netherlands-based Sencio that specializes in advanced packaging for smart sensing and actuation applications.

Natcast, the expected operator of the CHIPS for America National Semiconductor Technology Center (NSTC), ha annunciato che Synopsys ' Deirdre Hanford will serve as the organization’s first chief executive officer.

Design e potenza

Cadenza svelato several new apps for its Palladium Z2 emulation system — a four-state emulation app to accelerate simulations requiring X-propagation, such as for low-power verification of complex SoCs with multiple switched power domains; a real-number modeling app for simulations on mixed-signal designs; and a dynamic power analysis app with a massively parallel architecture for multi-billion-gate, million-clock-cycle power analysis of complex SoCs.

Infosys, which provides engineering services and consulting, will acquisire InSemi Technology, a provider of semiconductor design and embedded software development services. The acquisition is expected to close during Infosys’ fiscal Q4.

Nokia piani to invest €360 million (~$391 million) in software, hardware, and chip design at two German sites. The move is part of a four-year European IPCEI project, focused on the integrated development of software and high-performance SoCs for radio and optical products in future mobile communications systems based on the 5G-Advanced and 6G standards.

NVM Express introdotto a standardized, vendor-neutral framework for connecting applications to NVMe Computational Storage devices across both compute and storage services.

OIF pubblicato a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach. It specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect, with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range of 36 Gsym/s to 58 Gsym/s.

EnSilica aggiunto post-quantum cryptography accelerators to its eSi-Crypto range of hardware accelerator IP, covering the CRYSTALS Dilithium digital signature algorithm and Kyber key encapsulation mechanism.

QuEra Informatica e in Australia Centro di ricerca sui supercalcoli Pawsey volere collaboreranno on high-performance quantum emulation software optimized for Pawsey’s Setonix supercomputer to aid in research projects focused on quantum science and technology.

The Finnish Quantum Flagship (FQF) project lanciato with €13 million (~$14.2 million) from the Research Council of Finland, aiming to boost research in quantum materials, devices, and information and support commercial applications and technology transfer.

Argonne National Laboratory, le University of Chicago, and their partners collaborated to boost understanding of calcolo quantistico for financial applications.

Sicurezza

L'Istituto nazionale di standard e tecnologia (NIST) updated a publication offering guidance on how organizations can measure the effectiveness of their programmi di sicurezza informatica, and is soliciting public comments by March 18, 2024.

Security threats to multi-tenant FPGAs are growing, according to researchers at EPFL, Cyber-Defence Campus (Svizzera) e Northwestern Polytechnical University (China) who analyzed “the combined threat of FPGA power wasters and satisfiability don’t-care hardware Trojans in shared-cloud FPGAs.”

A novel module-level configuration methodology for programmable camouflaged logic can be implemented without additional hardware ports and with negligible resources, according to researchers at Tsinghua University, Pennsylvania State University, North Dakota State University, and University of Notre Dame.

Ricercatori a Università di New York Abu Dhabi built an ML analysis and attack framework of tools on certain memristor-based physical unclonable functions (MR-PUF).

I ricercatori del Laboratorio di informatica e intelligenza artificiale del MIT (MIT-CSAIL) found that “sensori di luce ambientale are vulnerable to privacy threats when embedded on a smart device’s screen.”

OpenAI sta lavorando con il Dipartimento della Difesa degli Stati Uniti on AI tools, including open-source strumenti di sicurezza informatica, and revised its policy page to no longer ban the use of its technology in military activity, reports CNBC.

Google’s Threat Analysis Group (TAG) observed that the Gruppo minaccioso russo, COLDRIVER, has gone “beyond phishing for credentials, to delivering malware via campaigns using PDFs as lure documents.”

L’Agenzia per la sicurezza informatica e le infrastrutture (CISA) e il Federal Bureau of Investigation (FBI) advised of Androxgh0st Malware, which establishes a botnet for victim identification and exploitation in vulnerable networks, and released cybersecurity guidance on Chinese-manufactured sistemi di aeromobili senza pilota (UAS). CISA rilasciato other alerts, as well, including an consultivo circa Drupal Nucleo.

Automotive e batterie

Il Governo degli Stati Uniti awarded nearly $150 million to 24 recipients in 20 states to make existing electric vehicle (EV) infrastruttura di ricarica more reliable. In sub-zero temperatures in Chicago, EV drivers found some charging stations either didn’t work, or charging took much longer. Many cars had to be towed away, according to CBS.

globali connected car sales rose 28% year over year in Q3 2023, and two-thirds of cars sold had embedded connectivity, according to Counterpoint. China had the most connected car sales, at 33%, then the U.S. and Europe. The three regions captured 75% of the market.

BYD lanciato its AI-powered smart car system, obtained a conditional testing license for L3 autonomous driving, and will invest 5 billion yuan ($701.8 million) to build all-terrain professional test drive sites in Chinese cities, reports CNBC.

Infineon collaborato con OMRON Social Solutions to combine Infineon’s gallium nitride (GaN) based power solutions with OMRON’s circuit topology and control technology, enabling one of Japan’s smallest and lightest vehicle-to-everything (V2X) charging systems and driving innovation towards wide bandgap materials in power supplies. Also, Infineon’s TRAVEO T2G Cluster automotive microcontrollers are now available with Finland-based Gruppo Qt'S soluzione grafica and its developer toolkit for building graphical user interfaces (GUI).

Mazda volere adottare Tesla’s North American Charging Standard (NACS) for its battery electric vehicles (BEVs) launched in North America from 2025.

Con sede in Cina Betavolt sviluppato a batteria nucleare with a 50-year life span, using nickel-63, decay technology, and diamond semiconductors to miniaturize, modularize, and reduce costs of atomic energy batteries, reports China Daily. (See Immagine.)

Informatica pervasiva e intelligenza artificiale

Renesas introduced a 64-bit general-purpose MPU for IoT edge and gateway devices, offering low power, fast startup, a PCI Express interface for high-speed 5G, and tamper detection. The company also debuted a dual-core Bluetooth low energy SoC with integrated flash, aimed at connected medical, asset tracking, and human interface devices.

globali Spedizioni PC ended Q4 2023 with a 0.2% year over year decline, and saw a 14% YoY decline for all of 2023, reports Counterpoint. Shipment momentum is expected to grow in the first half of 2024. Intel ed AMD have CPU solutions, Meteor Lake and Hawk Point, for next-gen AI PCs, which should drive demand.

Il globale AI server market, including AI training and inference, is expected to exceed 1.6 million units in 2024, at a growth rate of 40%, reports TrendForce, as edge AI applications shift toward AI PCs. And shipments of Apple'S Visione professionale could reach up to 600,000 units in 2024, expanding the virtual head-mounted device market.

In un Deloitte survey, three-quarters of respondents expect Gen AI to transform their organizations within three years. A quarter believe their organizations are well prepared to address governance and risk issues, and more than half are concerned that widespread use of Gen AI will increase economic inequality.

Al World Economic Forum 2024 in Davos:

• Il Nazioni unite' Secretary-General said “every new iteration of generative AI increases the risk of serious unintended consequences” and “some powerful tech companies are already pursuing profits with a clear disregard for human rights, personal privacy, and social impact.”
• Lo svizzero Dipartimento federale degli affari esteri, EPFL, Politecnico federale di Zurigo, and partners launched the International Computation and AI Network (ICAIN) to develop AI technologies that benefit society as a whole and help reduce global inequality.
• OpenAI L'amministratore delegato Sam Altman raggio on the future of AI.

Arizona State University ed OpenAI partnered to bring the capabilities of ChatGPT Enterprise into higher education, enhancing learning, creativity, and student outcomes.

Il Governo olandese presentato a vision of GenAI and announced €204.5 million (~$222 million) to the AINEd program for knowledge, innovation and the application of Dutch AI systems.

Infineon lanciato a magnetic position sensor housed in a small six-ball wafer-level package, suited for zoom lenses and focus adjustment in cameras, and a secondary-side controlled ZVS flyback converter chipset ideal for USB-C adapters, chargers, and travel adapters.

Infineon’s Imagimob updated its studio so users can visualize ML modeling workflows and leverage advanced capabilities to develop edge device models better and faster.

Fig.1: Imagimob Studio’s new Graph UX. Source: Infineon

Siemens collegato its Teamcenter Product Lifecycle Management (PLM) with Salesforce’s manufacturing and service clouds. The AI-based SaaS integration will help manufacturers build feedback loops between service execution and product development to foster innovation. And REJOOL adopted Siemens’ Xcelerator as a Service portfolio of industry software to help bring its PIONYR compressione dell'idrogeno technology to market.

Azienda di consegna con droni Ala, posseduto da Googlela società madre Alfabeto, launched a new aircraft with a range of 12 miles, cruising speed of 65 miles per hour, and the ability to carry a 5-pound delivery box.

Gli scienziati di Università di Wageningen, CON, Università di Yale, e il Jülich Research Center developed METEOR, a chameleon application that can train AI algorithms to classify objects in satellite images faster.

A new manufacturing approach for thin-film electrodes allows minimally invasive, high-res recording up to four inches inside the human brain. The monolithic probes are customizable and scalable due to thin-film technology derived from the semiconductor and digital-display screen industries, according to researchers at the University of California San Diego.

Rapporti approfonditi

Here are more new stories by the Semiconductor Engineering team:

Expert discussion: Which data works best for caduta di tensione simulazione?

3D integration supports calcolo in memoria’s versatility and accuracy, but new approaches are needed.

Reducing Power In data Center: New approaches to improving utilization while reducing guard-banding (video).

Eventi

Trova l'imminente industria dei chip events here:

Evento	Data	Dove
Mondo dell'automotive: fiera della tecnologia automobilistica avanzata	24 – 26 gennaio	Tokyo, Giappone
Velocità, protocollo e sicurezza: nuove sfide per la rete automobilistica	Gen 24	Novi, MI
SPIE Photonics Ovest	Jan 27 - Feb 1	San Francisco, CA
DesignCon 2024	Jan 30 - Feb 1	Santa Clara, CA
Vertice Chiplet	Febbraio 6 - 8	Santa Clara, CA
L'ascesa dell'informatica fotonica	Febbraio 7 - 8	San Jose, CA
Simposio sull'imballaggio a livello di wafer	Febbraio 13 - 15	Aeroporto Hyatt Regency San Francisco
Conferenza internazionale sui circuiti a stato solido IEEE 2024 (ISSCC)	Febbraio 18 - Febbraio 22	San Francisco, CA
Conferenza degli sviluppatori PCI-SIG	Febbraio 19 - Febbraio 20	Taipei, Taiwan
Premio e banchetto Phil Kaufman	Feb 22	San Jose, CA
Litografia avanzata SPIE + Patterning	Febbraio 25 - Febbraio 29	San Jose, California
Renesas Tech Day nel Regno Unito	Feb 27	Cambridge, Regno Unito
Tutti i prossimi eventi

I prossimi webinar sono qui, including talks on Cyber Trust Mark, debug and verification management, and EM simulation.

Ulteriori letture e newsletter

Leggi l'ultima rapporti speciali e storie principalio controlla l'ultima newsletter:

Sistemi e Design
Bassa potenza ad alte prestazioni
Test, misurazioni e analisi
Produzione, imballaggio e materiali
Automotive, sicurezza e computing pervasivo

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• Fonte: https://semiengineering.com/chip-industry-week-in-review-19/