5जी और 6जी की पैकेजिंग में चुनौतियां

Millimeter wave frequencies are essential for transferring more data more quickly, but they also requires different packaging technology to minimize loss and drift. That opens up a number of tradeoffs around antenna in package, antenna on package, flexible circuits, and different substrates. Curtis Zwenger, vice president of R&D at Amkor Technology, talks about a host of new challenges ranging from over-the-air testing and cross-talk to impedance matching.

[एम्बेडेड सामग्री]