चिप उद्योग सप्ताह की समीक्षा

जेसी एलन, ग्रेगरी हेली और लिज़ एलन द्वारा

Synopsys मर्जी अधिग्रहण Ans for about $35 billion in cash and stock. The deal will boost Synopsys’ multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025.

वर्ल्ड वाइड semiconductor revenue in 2023 totaled $533 billion, a decrease of 11.1% from 2022, according to preliminary results by Gartner. The combined semiconductor revenue of the top 25 semiconductor vendors declined 14.1% in 2023, accounting for 74.4% of the market, down from 77.2% in 2022.

However, simple formulas on how the chip industry is doing no longer apply. There are too many variables, and more on the way.

NIST added a new vulnerability that could impact generative AI security in data centers.  (CVE-2023-4969): “A GPU kernel can read sensitive data from another GPU kernel (even from another user or app) through an optimized GPU memory region called _local memory_ on various architectures.” Security firm Trails of Bits provides more यहाँ विवरण.

अधिक समाचारों के त्वरित लिंक:

 विनिर्माण और परीक्षण
डिजाइन और शक्ति
सुरक्षा
ऑटोमोटिव और बैटरी
व्यापक कंप्यूटिंग और एआई
गहन रिपोर्ट
आयोजन

विनिर्माण और परीक्षण

प्रोटोटेक uncorked a power reduction solution for the data center, mobile, communications and automotive markets. The new solution uses on-chip telemetry, coupled with machine learning and predictive analytics, to enable workload-aware reduction in power. The approach also reduces the amount of guard-banding needed inside a chip or package, which can have a big impact on power and cooling costs in data centers.

नवाचार पर रिहा a panel-level packaging inspection and metrology process control system aimed at buried defects and voids, targeting upcoming glass and copper-clad laminates (CCLs).

कीज़ and researchers from France’s Centre national de la recherche scientifique (CNRS), Lille University, तथा ओसाका विश्वविद्यालय तोड़ दिया 1Tbps barrier using a system built with a combination of terahertz photodiodes and an electronics-based receiver covering a range of 500-724 GHz.

TSMC and the Industrial Technology Research Institute (आईटीआरआई) सैन्यदल में शामिल हुए to research and develop a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.

फॉक्सकॉन और एचसीएल ग्रुप announced plans for a new OSAT facility in India, reports Reuters.

आमकोर और GLOBALFOUNDRIES kicked off their European partnership with a ribbon cutting समारोह at Amkor’s Porto, Portugal, facility. GF transferred 50 tools from its site in Dresden, Germany, to Porto.

Engineering and technology group Accuron Technologies प्राप्त RECIF Technologies, a France-based company specializing in the design, manufacture, and installation of robotic handling equipment for semiconductor wafer-handling.

नेवेज़ पूरा किया अर्जन of Netherlands-based Sencio that specializes in advanced packaging for smart sensing and actuation applications.

Natcast, the expected operator of the CHIPS for America National Semiconductor Technology Center (NSTC), की घोषणा कि 'Synopsys Deirdre Hanford will serve as the organization’s first chief executive officer.

डिजाइन और शक्ति

ताल अनावरण किया several new apps for its Palladium Z2 emulation system — a four-state emulation app to accelerate simulations requiring X-propagation, such as for low-power verification of complex SoCs with multiple switched power domains; a real-number modeling app for simulations on mixed-signal designs; and a dynamic power analysis app with a massively parallel architecture for multi-billion-gate, million-clock-cycle power analysis of complex SoCs.

इंफोसिस, which provides engineering services and consulting, will अधिग्रहण InSemi Technology, a provider of semiconductor design and embedded software development services. The acquisition is expected to close during Infosys’ fiscal Q4.

नोकिया योजनाओं to invest €360 million (~$391 million) in software, hardware, and chip design at two German sites. The move is part of a four-year European IPCEI project, focused on the integrated development of software and high-performance SoCs for radio and optical products in future mobile communications systems based on the 5G-Advanced and 6G standards.

एनवीएम एक्सप्रेस शुरू की a standardized, vendor-neutral framework for connecting applications to NVMe Computational Storage devices across both compute and storage services.

ओआइएफ प्रकाशित a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach. It specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect, with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range of 36 Gsym/s to 58 Gsym/s.

एनसिलिका जोड़ा post-quantum cryptography accelerators to its eSi-Crypto range of hardware accelerator IP, covering the CRYSTALS Dilithium digital signature algorithm and Kyber key encapsulation mechanism.

क्वेरा कम्प्यूटिंग और ऑस्ट्रेलिया का पावसी सुपरकंप्यूटिंग रिसर्च सेंटर मर्जी सहयोग on high-performance quantum emulation software optimized for Pawsey’s Setonix supercomputer to aid in research projects focused on quantum science and technology.

The Finnish Quantum Flagship (FQF) project शुभारंभ with €13 million (~$14.2 million) from the फ़िनलैंड की अनुसंधान परिषद, aiming to boost research in quantum materials, devices, and information and support commercial applications and technology transfer.

Argonne राष्ट्रीय प्रयोगशाला, शिकागो विश्वविद्यालय, and their partners collaborated to boost understanding of क्वांटम कम्प्यूटिंग for financial applications.

सुरक्षा

राष्ट्रीय मानक और प्रौद्योगिकी संस्थान (NIST) updated a publication offering guidance on how organizations can measure the effectiveness of their साइबर सुरक्षा कार्यक्रम, and is soliciting public comments by March 18, 2024.

Security threats to multi-tenant FPGAs are growing, according to researchers at EPFL, साइबर रक्षा परिसर (Switzerland), and नॉर्थवेस्टर्न पॉलिटेक्निकल यूनिवर्सिटी (China) who analyzed “the combined threat of FPGA power wasters and satisfiability don’t-care hardware Trojans in shared-cloud FPGAs.”

A novel module-level configuration methodology for programmable camouflaged logic can be implemented without additional hardware ports and with negligible resources, according to researchers at Tsinghua University, Pennsylvania State University, North Dakota State University, and University of Notre Dame.

पर शोधकर्ताओं न्यूयॉर्क विश्वविद्यालय अबू धाबी built an ML analysis and attack framework of tools on certain memristor-based physical unclonable functions (MR-PUF).

Researchers from MIT’s Computer Science and Artificial Intelligence Laboratory (MIT-CSAIL) found that “परिवेश प्रकाश सेंसर are vulnerable to privacy threats when embedded on a smart device’s screen.”

OpenAI के साथ काम कर रहा है अमेरिकी रक्षा विभाग on AI tools, including open-source साइबर सुरक्षा उपकरण, and revised its policy page to no longer ban the use of its technology in military activity, reports CNBC.

गूगल’s Threat Analysis Group (TAG) observed that the रूसी खतरा समूह, COLDRIVER, has gone “beyond phishing for credentials, to delivering malware via campaigns using PDFs as lure documents.”

साइबर सुरक्षा और बुनियादी ढांचा सुरक्षा एजेंसी (सीआईएसए) और संघीय जांच ब्यूरो (एफबीआई) advised of Androxgh0st Malware, which establishes a botnet for victim identification and exploitation in vulnerable networks, and released cybersecurity guidance on Chinese-manufactured मानव रहित विमान प्रणाली (यूएएस)। सीआईएसए निर्गत other alerts, as well, including an सलाहकार के विषय में Drupal कोर।

ऑटोमोटिव और बैटरी

RSI अमेरिकी सरकार awarded nearly $150 million to 24 recipients in 20 states to make existing electric vehicle (EV) चार्जिंग बुनियादी ढांचे more reliable. In sub-zero temperatures in Chicago, EV drivers found some charging stations either didn’t work, or charging took much longer. Many cars had to be towed away, according to CBS.

वैश्विक connected car sales rose 28% year over year in Q3 2023, and two-thirds of cars sold had embedded connectivity, according to Counterpoint. China had the most connected car sales, at 33%, then the U.S. and Europe. The three regions captured 75% of the market.

BYD शुभारंभ its AI-powered smart car system, obtained a conditional testing license for L3 autonomous driving, and will invest 5 billion yuan ($701.8 million) to build all-terrain professional test drive sites in Chinese cities, reports CNBC.

Infineon भागीदारी साथ में OMRON Social Solutions to combine Infineon’s gallium nitride (GaN) based power solutions with OMRON’s circuit topology and control technology, enabling one of Japan’s smallest and lightest vehicle-to-everything (V2X) charging systems and driving innovation towards wide bandgap materials in power supplies. Also, Infineon’s TRAVEO T2G Cluster automotive microcontrollers are now available with Finland-based क्यूटीग्रुपहै ग्राफ़िक्स समाधान and its developer toolkit for building graphical user interfaces (GUI).

माजदा मर्जी अपनाना टेस्ला’s North American Charging Standard (NACS) for its battery electric vehicles (BEVs) launched in North America from 2025.

चीन-आधारित बीटावोल्ट विकसित एक परमाणु बैटरी with a 50-year life span, using nickel-63, decay technology, and diamond semiconductors to miniaturize, modularize, and reduce costs of atomic energy batteries, reports China Daily. (See की छवि.)

व्यापक कंप्यूटिंग और एआई

Renesas introduced a 64-bit general-purpose MPU for IoT edge and gateway devices, offering low power, fast startup, a PCI Express interface for high-speed 5G, and tamper detection. The company also debuted a dual-core Bluetooth low energy SoC with integrated flash, aimed at connected medical, asset tracking, and human interface devices.

वैश्विक पीसी शिपमेंट ended Q4 2023 with a 0.2% year over year decline, and saw a 14% YoY decline for all of 2023, reports Counterpoint. Shipment momentum is expected to grow in the first half of 2024. इंटेल और एएमडी have CPU solutions, Meteor Lake and Hawk Point, for next-gen AI PCs, which should drive demand.

वैश्विक AI server market, including AI training and inference, is expected to exceed 1.6 million units in 2024, at a growth rate of 40%, reports TrendForce, as edge AI applications shift toward AI PCs. And shipments of Appleहै विजन प्रो could reach up to 600,000 units in 2024, expanding the virtual head-mounted device market.

में डेलॉइट survey, three-quarters of respondents expect Gen AI to transform their organizations within three years. A quarter believe their organizations are well prepared to address governance and risk issues, and more than half are concerned that widespread use of Gen AI will increase economic inequality.

पर विश्व आर्थिक मंच 2024 in Davos:

• RSI संयुक्त राष्ट्र' Secretary-General said “every new iteration of generative AI increases the risk of serious unintended consequences” and “some powerful tech companies are already pursuing profits with a clear disregard for human rights, personal privacy, and social impact.”
• स्विस Federal Department of Foreign Affairs, EPFL, ETH ज्यूरिख, and partners launched the International Computation and AI Network (ICAIN) to develop AI technologies that benefit society as a whole and help reduce global inequality.
• OpenAI सीईओ सैम अल्टमैन बोला on the future of AI.

एरिजोना राज्य विश्वविद्यालय और OpenAI partnered to bring the capabilities of ChatGPT Enterprise into higher education, enhancing learning, creativity, and student outcomes.

RSI डच सरकार प्रस्तुत किया vision of GenAI and announced €204.5 million (~$222 million) to the AINEd program for knowledge, innovation and the application of Dutch AI systems.

Infineon लॉन्च किया गया magnetic position sensor housed in a small six-ball wafer-level package, suited for zoom lenses and focus adjustment in cameras, and a secondary-side controlled ZVS flyback converter chipset ideal for USB-C adapters, chargers, and travel adapters.

Infineon’s Imagimob updated its studio so users can visualize ML modeling workflows and leverage advanced capabilities to develop edge device models better and faster.

चित्र .1: Imagimob Studio’s new Graph UX. Source: Infineon

सीमेंस जुड़ा हुआ its Teamcenter Product Lifecycle Management (PLM) with Salesforce’s manufacturing and service clouds. The AI-based SaaS integration will help manufacturers build feedback loops between service execution and product development to foster innovation. And REJOOL adopted Siemens’ Xcelerator as a Service portfolio of industry software to help bring its PIONYR हाइड्रोजन संपीड़न technology to market.

ड्रोन डिलीवरी कंपनी विंग, के स्वामित्व गूगलकी मूल कंपनी वर्णमाला, launched a new aircraft with a range of 12 miles, cruising speed of 65 miles per hour, and the ability to carry a 5-pound delivery box.

से वैज्ञानिकों विश्वविद्यालय, एमआईटी, येल विश्वविद्यालय, और Jülich Research Center developed METEOR, a chameleon application that can train AI algorithms to classify objects in satellite images faster.

A new manufacturing approach for thin-film electrodes allows minimally invasive, high-res recording up to four inches inside the human brain. The monolithic probes are customizable and scalable due to thin-film technology derived from the semiconductor and digital-display screen industries, according to researchers at the कैलिफोर्निया के सैन डिएगो के विश्वविद्यालय.

गहन रिपोर्ट

Here are more new stories by the Semiconductor Engineering team:

Expert discussion: Which data works best for वोल्टेज का गिरना अनुकरण?

3D integration supports कंप्यूट-इन-मेमोरी’s versatility and accuracy, but new approaches are needed.

Reducing Power In डेटा केंद्र: New approaches to improving utilization while reducing guard-banding (video).

आयोजन

आगामी चिप उद्योग खोजें events here:

कार्यक्रम	तारीख	पता
ऑटोमोटिव वर्ल्ड: एडवांस्ड ऑटोमोटिव टेक्नोलॉजी शो	जनवरी 24 - 26	टोक्यो, जापान
गति, प्रोटोकॉल और सुरक्षा: नई ऑटोमोटिव नेटवर्क चुनौतियाँ	जनवरी 24	नोवी, एमआई
SPIE फोटोनिक्स वेस्ट	27 जनवरी - 1 फरवरी	सैन फ्रांसिस्को, सीए
डिजाइनकॉन 2024	30 जनवरी - 1 फरवरी	सांता क्लारा, CA
चिपलेट शिखर सम्मेलन	फ़रवरी 6 - 8	सांता क्लारा, CA
फोटोनिक कंप्यूटिंग का उदय	फ़रवरी 7 - 8	सैन जोस, CA
वेफर-स्तरीय पैकेजिंग संगोष्ठी	फ़रवरी 13 - 15	हयात रीजेंसी सैन फ्रांसिस्को हवाई अड्डा
2024 IEEE अंतर्राष्ट्रीय सॉलिड-स्टेट सर्किट सम्मेलन (ISSCC)	फरवरी 18 - फरवरी 22	सैन फ्रांसिस्को, सीए
पीसीआई-एसआईजी डेवलपर्स सम्मेलन	फरवरी 19 - फरवरी 20	ताइपेई, ताइवान
Phil Kaufman Award and Banquet	फ़रवरी 22	सैन जोस, CA
SPIE उन्नत लिथोग्राफी + पैटर्निंग	फरवरी 25 - फरवरी 29	San Jose, CA
Renesas Tech Day UK	फ़रवरी 27	कैम्ब्रिज, यूके
सभी आगामी कार्यक्रम

आगामी वेबिनार हैं यहाँ, including talks on Cyber Trust Mark, debug and verification management, and EM simulation.

आगे पढ़ना और समाचारपत्रिकाएँ

नवीनतम पढ़ें विशेष रिपोर्ट और शीर्ष कहानियाँ, या नवीनतम देखें समाचार पत्र:

सिस्टम और डिज़ाइन
कम शक्ति-उच्च प्रदर्शन
परीक्षण, मापन और विश्लेषण
विनिर्माण, पैकेजिंग और सामग्री
ऑटोमोटिव, सुरक्षा और व्यापक कंप्यूटिंग

• एसईओ संचालित सामग्री और पीआर वितरण। आज ही प्रवर्धित हो जाओ।
• प्लेटोडेटा.नेटवर्क वर्टिकल जेनरेटिव एआई। स्वयं को शक्तिवान बनाएं। यहां पहुंचें।
• प्लेटोआईस्ट्रीम। Web3 इंटेलिजेंस। ज्ञान प्रवर्धित। यहां पहुंचें।
• प्लेटोईएसजी. कार्बन, क्लीनटेक, ऊर्जा, पर्यावरण, सौर, कचरा प्रबंधन। यहां पहुंचें।
• प्लेटोहेल्थ। बायोटेक और क्लिनिकल परीक्षण इंटेलिजेंस। यहां पहुंचें।
• स्रोत: https://semiengineering.com/chip-industry-week-in-review-19/