Kiibitööstuse nädala ülevaade

By Jesse Allen, Gregory Haley, and Liz Allan

Synopsys will omandama Ansys for about $35 billion in cash and stock. The deal will boost Synopsys’ multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025.

Ülemaailmne semiconductor revenue in 2023 totaled $533 billion, a decrease of 11.1% from 2022, according to preliminary results by Gartner. The combined semiconductor revenue of the top 25 semiconductor vendors declined 14.1% in 2023, accounting for 74.4% of the market, down from 77.2% in 2022.

However, simple formulas on how the chip industry is doing no longer apply. There are too many variables, and more on the way.

NIST added a new vulnerability that could impact generative AI security in data centers.  (CVE-2023-4969): “A GPU kernel can read sensitive data from another GPU kernel (even from another user or app) through an optimized GPU memory region called _local memory_ on various architectures.” Security firm Trails of Bits provides more üksikasjad siin.

Kiirlingid rohkemate uudiste juurde:

 Tootmine ja katsetamine
Disain ja võimsus
TURVALISUS
Autod ja akud
Läbiv andmetöötlus ja AI
Põhjalikud aruanded
Sündmused

Tootmine ja katsetamine

proteanTecs uncorked a power reduction solution for the data center, mobile, communications and automotive markets. The new solution uses on-chip telemetry, coupled with machine learning and predictive analytics, to enable workload-aware reduction in power. The approach also reduces the amount of guard-banding needed inside a chip or package, which can have a big impact on power and cooling costs in data centers.

Innovatsioonile vabastatud a panel-level packaging inspection and metrology process control system aimed at buried defects and voids, targeting upcoming glass and copper-clad laminates (CCLs).

Klaviatuur and researchers from France’s Centre national de la recherche scientifique (CNRS), Lille Universityja Osaka ülikool murdis ära 1Tbps barrier using a system built with a combination of terahertz photodiodes and an electronics-based receiver covering a range of 500-724 GHz.

TSMC and the Industrial Technology Research Institute (ITRI) ühendanud oma jõud to research and develop a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.

Foxconn ja HCL grupp announced plans for a new OSAT facility in India, reports Reuters.

Amkor ja GlobalFoundries kicked off their European partnership with a ribbon cutting tseremoonia at Amkor’s Porto, Portugal, facility. GF transferred 50 tools from its site in Dresden, Germany, to Porto.

Engineering and technology group Accuron Technologies omandatud RECIF Technologies, a France-based company specializing in the design, manufacture, and installation of robotic handling equipment for semiconductor wafer-handling.

Neways valmis omandamine of Netherlands-based Sencio that specializes in advanced packaging for smart sensing and actuation applications.

Natcast, the expected operator of the CHIPS for America National Semiconductor Technology Center (NSTC), teatas et kokkuvõte Deirdre Hanford will serve as the organization’s first chief executive officer.

Disain ja võimsus

Cadence Avalikustas several new apps for its Palladium Z2 emulation system — a four-state emulation app to accelerate simulations requiring X-propagation, such as for low-power verification of complex SoCs with multiple switched power domains; a real-number modeling app for simulations on mixed-signal designs; and a dynamic power analysis app with a massively parallel architecture for multi-billion-gate, million-clock-cycle power analysis of complex SoCs.

InfoSys, which provides engineering services and consulting, will omandama InSemi Technology, a provider of semiconductor design and embedded software development services. The acquisition is expected to close during Infosys’ fiscal Q4.

Nokia plaanid to invest €360 million (~$391 million) in software, hardware, and chip design at two German sites. The move is part of a four-year European IPCEI project, focused on the integrated development of software and high-performance SoCs for radio and optical products in future mobile communications systems based on the 5G-Advanced and 6G standards.

NVM Express sisse a standardized, vendor-neutral framework for connecting applications to NVMe Computational Storage devices across both compute and storage services.

OIF avaldatud a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach. It specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect, with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range of 36 Gsym/s to 58 Gsym/s.

EnSilica lisatud post-quantum cryptography accelerators to its eSi-Crypto range of hardware accelerator IP, covering the CRYSTALS Dilithium digital signature algorithm and Kyber key encapsulation mechanism.

Quera andmetöötlus ja Austraalia omad Pawsey superarvutite uurimiskeskus will Teevad koostööd on high-performance quantum emulation software optimized for Pawsey’s Setonix supercomputer to aid in research projects focused on quantum science and technology.

The Finnish Quantum Flagship (FQF) project käivitatud with €13 million (~$14.2 million) from the Research Council of Finland, aiming to boost research in quantum materials, devices, and information and support commercial applications and technology transfer.

Argonne'i riiklik labor, University of Chicago, and their partners collaborated to boost understanding of kvantarvutus for financial applications.

TURVALISUS

Riiklik standardite ja tehnoloogia instituut (NIST) updated a publication offering guidance on how organizations can measure the effectiveness of their cybersecurity programs, and is soliciting public comments by March 18, 2024.

Security threats to multi-tenant FPGAs are growing, according to researchers at EPFL, Küberkaitselinnak (Switzerland), and Loode-Polütehniline Ülikool (China) who analyzed “the combined threat of FPGA power wasters and satisfiability don’t-care hardware Trojans in shared-cloud FPGAs.”

A novel module-level configuration methodology for programmable camouflaged logic can be implemented without additional hardware ports and with negligible resources, according to researchers at Tsinghua University, Pennsylvania State University, North Dakota State University, and University of Notre Dame.

Teadlased New Yorgi ülikool Abu Dhabi built an ML analysis and attack framework of tools on certain memristor-based physical unclonable functions (MR-PUF).

MITi arvutiteaduse ja tehisintellekti labori teadlased (MIT-CSAIL) found that “ümbritseva valguse andurid are vulnerable to privacy threats when embedded on a smart device’s screen.”

OpenAI töötab koos USA kaitseministeerium on AI tools, including open-source küberturvalisuse tööriistad, and revised its policy page to no longer ban the use of its technology in military activity, reports CNBC.

Google’s Threat Analysis Group (TAG) observed that the Vene ohurühmitus, COLDRIVER, has gone “beyond phishing for credentials, to delivering malware via campaigns using PDFs as lure documents.”

Küberturvalisuse ja infrastruktuuri turvalisuse agentuur (CISA) ja Föderaalne Juurdlusbüroo (FBI) advised of Androxgh0st Malware, which establishes a botnet for victim identification and exploitation in vulnerable networks, and released cybersecurity guidance on Chinese-manufactured unmanned aircraft systems (UAS). CISA emiteeritud other alerts, as well, including an nõuandev kohta Drupal Tuum.

Autod ja akud

. USA valitsus awarded nearly $150 million to 24 recipients in 20 states to make existing electric vehicle (EV) laadimistaristu more reliable. In sub-zero temperatures in Chicago, EV drivers found some charging stations either didn’t work, or charging took much longer. Many cars had to be towed away, according to CBS.

Globaalne connected car sales rose 28% year over year in Q3 2023, and two-thirds of cars sold had embedded connectivity, according to Counterpoint. China had the most connected car sales, at 33%, then the U.S. and Europe. The three regions captured 75% of the market.

BYD käivitatud its AI-powered smart car system, obtained a conditional testing license for L3 autonomous driving, and will invest 5 billion yuan ($701.8 million) to build all-terrain professional test drive sites in Chinese cities, reports CNBC.

Infineon partnerlusega koos OMRON Social Solutions to combine Infineon’s gallium nitride (GaN) based power solutions with OMRON’s circuit topology and control technology, enabling one of Japan’s smallest and lightest vehicle-to-everything (V2X) charging systems and driving innovation towards wide bandgap materials in power supplies. Also, Infineon’s TRAVEO T2G Cluster automotive microcontrollers are now available with Finland-based Qt Grupp'S graafiline lahendus and its developer toolkit for building graphical user interfaces (GUI).

Mazda will vastu võtma Teslal’s North American Charging Standard (NACS) for its battery electric vehicles (BEVs) launched in North America from 2025.

Hiinas asuv Betavolt arenenud a tuumapatarei with a 50-year life span, using nickel-63, decay technology, and diamond semiconductors to miniaturize, modularize, and reduce costs of atomic energy batteries, reports China Daily. (See pilt.)

Läbiv andmetöötlus ja AI

Renesas introduced a 64-bit general-purpose MPU for IoT edge and gateway devices, offering low power, fast startup, a PCI Express interface for high-speed 5G, and tamper detection. The company also debuted a dual-core Bluetooth low energy SoC with integrated flash, aimed at connected medical, asset tracking, and human interface devices.

Globaalne PC saadetised ended Q4 2023 with a 0.2% year over year decline, and saw a 14% YoY decline for all of 2023, reports Counterpoint. Shipment momentum is expected to grow in the first half of 2024. Intel ja AMD have CPU solutions, Meteor Lake and Hawk Point, for next-gen AI PCs, which should drive demand.

Globaalne AI server market, including AI training and inference, is expected to exceed 1.6 million units in 2024, at a growth rate of 40%, reports TrendForce, as edge AI applications shift toward AI PCs. And shipments of õun'S VisionPro could reach up to 600,000 units in 2024, expanding the virtual head-mounted device market.

Aastal Deloitte survey, three-quarters of respondents expect Gen AI to transform their organizations within three years. A quarter believe their organizations are well prepared to address governance and risk issues, and more than half are concerned that widespread use of Gen AI will increase economic inequality.

Kell Maailma Majandusfoorum 2024 in Davos:

• . Ühendrahvad' Secretary-General said “every new iteration of generative AI increases the risk of serious unintended consequences” and “some powerful tech companies are already pursuing profits with a clear disregard for human rights, personal privacy, and social impact.”
• Šveits Federal Department of Foreign Affairs, EPFL, ETH Zürich, and partners launched the International Computation and AI Network (ICAIN) to develop AI technologies that benefit society as a whole and help reduce global inequality.
• OpenAI Tegevjuht Sam Altman kodar on the future of AI.

Arizona State University ja OpenAI partnered to bring the capabilities of ChatGPT Enterprise into higher education, enhancing learning, creativity, and student outcomes.

. Hollandi valitsus esitas a vision of GenAI and announced €204.5 million (~$222 million) to the AINEd program for knowledge, innovation and the application of Dutch AI systems.

Infineon käivitas a magnetic position sensor housed in a small six-ball wafer-level package, suited for zoom lenses and focus adjustment in cameras, and a secondary-side controlled ZVS flyback converter chipset ideal for USB-C adapters, chargers, and travel adapters.

Infineon’s Imagimob updated its studio so users can visualize ML modeling workflows and leverage advanced capabilities to develop edge device models better and faster.

Joonis 1: Imagimob Studio’s new Graph UX. Source: Infineon

Siemens seotud its Teamcenter Product Lifecycle Management (PLM) with Sales Force’s manufacturing and service clouds. The AI-based SaaS integration will help manufacturers build feedback loops between service execution and product development to foster innovation. And REJOOL adopted Siemens’ Xcelerator as a Service portfolio of industry software to help bring its PIONYR hydrogen compression technology to market.

Droonide kohaletoimetamise ettevõte tiib, mille omanik on Googleemaettevõtja Tähestik, launched a new aircraft with a range of 12 miles, cruising speed of 65 miles per hour, and the ability to carry a 5-pound delivery box.

Teadlased Wageningeni ülikool, MIT, Yale'i ülikoolJa Jülich Research Center developed METEOR, a chameleon application that can train AI algorithms to classify objects in satellite images faster.

A new manufacturing approach for thin-film electrodes allows minimally invasive, high-res recording up to four inches inside the human brain. The monolithic probes are customizable and scalable due to thin-film technology derived from the semiconductor and digital-display screen industries, according to researchers at the California San Diego Ülikool.

Põhjalikud aruanded

Here are more new stories by the Semiconductor Engineering team:

Expert discussion: Which data works best for voltage droop simulation?

3D integration supports mälus arvutamine’s versatility and accuracy, but new approaches are needed.

Reducing Power In andmekeskuste: New approaches to improving utilization while reducing guard-banding (video).

Sündmused

Otsige üles tulevane kiibitööstus events here:

sündmus	kuupäev	asukoht
Automotive World: Advanced Automotive Technology Show	24. – 26. jaanuar	Tokyo, Jaapan
Kiirus, protokoll ja turvalisus: uued autotööstuse võrgu väljakutsed	Jan 24	Novi, MI
SPIE Photonics West	27. jaanuar - 1. veebruar	San Francisco, CA
DesignCon 2024	30. jaanuar - 1. veebruar	Santa Clara, CA
Chipleti tippkohtumine	6-8 veebruar	Santa Clara, CA
Fotoonilise andmetöötluse tõus	7-8 veebruar	San Jose, CA
Vahvlitasemel pakendite sümpoosion	13-15 veebruar	Hyatt Regency San Francisco lennujaam
2024. aasta IEEE rahvusvaheline tahkisahelate konverents (ISSCC)	18. veebruar – 22. veebruar	San Francisco, CA
PCI-SIG Developers Conference	19. veebruar – 20. veebruar	Taipei, Taiwan
Phil Kaufman Award and Banquet	veebruar 22	San Jose, CA
SPIE täiustatud litograafia + muster	25. veebruar – 29. veebruar	San Jose, CA
Renesas Tech Day UK	veebruar 27	Cambridge, Suurbritannias
Kõik eelseisvad sündmused

Tulevased veebiseminarid on siit including talks on Cyber Trust Mark, debug and verification management, and EM simulation.

Edasine lugemine ja infolehed

Loe viimast eriaruanded ja tipploodvõi vaadake hiljemalt uudiskirjad:

Süsteemid ja disain
Väike võimsus – suur jõudlus
Test, mõõtmine ja analüüs
Tootmine, pakendamine ja materjalid
Autotööstus, turvalisus ja kõikehõlmav andmetöötlus

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• PlatoTervis. Biotehnoloogia ja kliiniliste uuringute luureandmed. Juurdepääs siia.
• Allikas: https://semiengineering.com/chip-industry-week-in-review-19/