Ανασκόπηση της εβδομάδας βιομηχανίας τσιπ

Ανασκόπηση της εβδομάδας βιομηχανίας τσιπ

Χρονική σήμανση: 12 Ιανουαρίου 2024 3:01 π.μ.
Κόμβος πηγής: 3057208

By Jesse Allen, Karen Heyman, and Liz Allan

Renesas θα αποκτούν Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications.

Κυματισμός φωνής αποκτήθηκαν Invecas, a provider of design engineering, embedded software, and system-level solutions. As part of the deal, Cadence will gain expertise in advanced nodes, mixed-signal, verification, embedded software, packaging, and turnkey custom silicon production to help scale the company’s system design engineering offerings. Terms were not disclosed.

Έσοδα του κλάδου EDA αυξημένη 25.2% to $4,702.4 million in the third quarter of 2023 compared to the same quarter last year, according to the ESD Alliance’s Electronic Design Market Data report. The four-quarter moving average rose 13.8%, which was the highest overall growth since Q4 1998.

Γρήγοροι σύνδεσμοι για περισσότερα νέα:

Σχεδιασμός και Ισχύς
Κατασκευή και δοκιμή
Αυτοκίνητο και Μπαταρίες
Ασφάλεια
Pervasive Computing και AI
Αναφορές σε βάθος
Εκδηλώσεις

Σχεδιασμός και Ισχύς

Ansys ξεκίνησε a physics-agnostic software-as-a-service application (SaaS) that can speed up computation-heavy designs by 10 to 100X, combining predictive simulation with generative AI.

Expedera‘s Origin NPUs now προσφορά native support for large language models, including stable diffusion, for generative AI on edge devices.

At CES 2024:

  • Intel ανακοίνωσε its full Core 14th Gen mobile and desktop processor lineup.
  • AMD εισήγαγε the AMD Ryzen 8000G Series desktop processors and Ryzen AI, bringing a dedicated AI neural processing unit (NPU) to desktop PC processors for the first time.
  • NVIDIA ανακοίνωσε GPUs for better generative AI performance, new AI laptops, and RTX-accelerated AI software and tools for developers and consumers.
  • Τετράγωνο offered sessions on how the general-purpose neural processing unit (GPNPU) solves ML inference chip design προκλήσεις.

Ambarella άνεργος its N1 AI processor SoC for server-grade performance under 50W, along with a selection of pre-ported and optimized LLMs for generative AI and multi-modal vision analysis.

micron Technology έκανε το ντεμπούτο του LPDDR5X memory in the new LPCAMM2 (low-power compression attached memory module) form factor for laptop PCs.

DreamBig Semiconductor εισήγαγε a platform for developing chiplet-based designs. It offers standard interfaces and architecture agnostic support for CPU, AI, accelerator, I/O, and memory chiplets that can be composed in a package; secure boot and management of chiplets; an architecture with direct access from all chiplets to cache/memory tiers; and RDMA Ethernet networking.

Global Unichip Corporation (GUC) μεταχειρισμένος Cadence's Integrity 3D-IC Platform to assist in taping out a 3D stacked die design on an advanced finFET process involving a memory-on-logic configuration achieved with a wafer-on-wafer structure using a flip-chip chip scale package.

ΣΕΓΚΕΡ άνεργος an IDE for embedded software that supports both RISC-V and Arm targets.

Meanwhile, DRAM contract prices will increase by approximately 13% to 18% in Q1 2024, with mobile DRAM leading the recovery, reports TrendForce.

QuEra Computing ανακοίνωσε its roadmap for a series of error-corrected quantum computers, with the aim of building a system with 100 logical error-corrected qubits and over 10,000 physical qubits in 2026.

Ερευνητές από Εθνικό Εργαστήριο Argonne, τη Πανεπιστήμιο του Σικάγου, τη Πανεπιστήμιο της Αϊόβα, να Πανεπιστήμιο Tohoku are using magnets to enable longer-distance επικοινωνία between the nitrogen vacancy centers in diamonds that can be used as qubits.

ΡΙΚΕΝ θα περιλαμβάνουν Το Quantinuum ion-trap quantum computing technology as part of a project to build a quantum-HPC hybrid platform.

Κατασκευή και δοκιμή

SkyWater Florida και Deca κέρδισε ένα Βραβείο 120 εκατ. Δολαρίων from the U.S. Dept. of Defense  to expand domestic fan-out wafer level packaging capabilities.

ΣΚ Σίλτρον θα παρέχει Infineon with 150-millimeter SiC wafers, supporting the production of SiC semiconductors. Later, SK Siltron will assist Infineon’s transition to 200-millimeter wafers.

Glass substrates are starting to κέρδος έλξης in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today.

Κίνα εξέφρασε ανησυχία to U.S. Commerce Secretary Gina Raimondo over U.S. curbs that prevent other countries from exporting lithography machines to China, reports Reuters.

Της Ινδίας Ομάδα Tata σχεδιάζει να build a semiconductor fabrication plant in Gujarat this year. Construction of 20 GWh battery plant to start soon, the group seeks to establish EV tech hub in Sanand, Gujarat, reports Bloomberg.

ΣΙΑ announced global semiconductor industry sales ανήλθαν σε 48.0 δισεκατομμύρια δολάρια during the month of November 2023, an increase of 5.3% compared to the November 2022 total of $45.6 billion and 2.9% more than the October 2023 total of $46.6 billion.

Purdue University, in conjunction with industry leaders and other leading engineering schools, is προσφορά Semiconductor Fabrication 101, a free, online course in the fundamentals of semiconductor fabrication.

Η Michigan Economic Development Corporation (MEDC) announced $4.6 million in grants and funds to support eight local higher education institutions’ semiconductor education and προγράμματα εκπαίδευσης.

Αυτοκίνητο και Μπαταρίες

There was a ton of auto news at CES 2024. Among the highlights:

Intel ανακοίνωσε ότι θα αποκτούν Silicon Mobility SAS to bring AI efficiencies to electric vehicle (EV) energy management. The company also said new AI-enhanced software-defined vehicle SoCs will enable in-vehicle AI and camera-based driver/passenger monitoring. In addition, the company plans to deliver an open automotive chiplet platform so customers can integrate their own chiplet into an Intel automotive product.

Infineon και Aurora Labs unveiled a set of AI-based solutions to improve the αξιοπιστία και ασφάλεια of critical automotive components, including steering, braking, and airbags.

Synopsys και συνεργάτες έδειξε how to optimize automotive SoCs, expedite SDV validation, and increase vehicle safety and security across the supply chain. Separately, the company offered four automotive predictions for 2024, including centralized zonal architecture.

Παρακολούθηση showcased solutions to επιτάχυνση της καινοτομίας in EV development.

NXP επέκτεινε το ραντάρ αυτοκινήτου one-chip family, monolithically integrating a high-performance radar transceiver, a multi-core radar processor, and a MACsec hardware engine for secure data communication over Automotive Ethernet.

pSemi introduced an automotive-grade ultra-wideband (UWB) RF switch.

Texas Instruments (ΕΣΕΙΣ) έκανε το ντεμπούτο του an industry-first single-chip radar sensor designed for satellite architectures and enabling more accurate advanced driver assistance systems (ADAS) decision-making, plus new driver chips to support control of power flow in battery management or other powertrain systems.

Qualcomm και Bosch εισήγαγε ένα central vehicle computer capable of running infotainment and ADAS functionalities on a single SoC.

Ambarella επέκτεινε το αυτόνομη οδήγηση AI domain controller family with two new SoCs. One supports a sensing suite to enable mainstream L2+ feature sets, such as highway autopilot and automated parking. The other enables advanced L2+ (L2++) with urban autopilot.

NVIDIA είπε four Chinese companies, including phonemaker Xiaomi, will use its DRIVE technology to power automated driving.

Συστήματα Αυτοκινήτων Panasonic ανακοίνωσε το high-performance compute (HPC) system, Neuron, to address the needs for SDV advancements, allowing for both software and hardware updates and upgrades across platform lifecycles.

BMW κατέδειξε augmented reality (AR) glasses for driving and partnered with Amazon to show voice assistant LLM capabilities based on a current development project. Separately, BMW said its parent plant in Munich will produce only EVs, starting in 2027.

Volkswagen presented vehicles with Ενσωματωμένο ChatGPT into its IDA voice assistant.

Ευρωπαϊκός εισήγαγε ένα biometric face authentication system, enabling the vehicle to open and start up as soon as it detects a registered user, with the ability to detect attempted deception.

Στελάντης, BlackBerry, να AWS ξεκίνησε α εικονικό πιλοτήριο to enhance in-vehicle software engineering.

Hyundai θα επεκτείνουν its hydrogen initiatives and transition from SDV to SDx, or software-defined everything.

Kia αποκάλυψε its highly modular Platform Beyond Vehicle (PBV) strategy for five concept models, featuring Hyundai’s SDx technology.

Honda έκανε πρεμιέρα two futuristic looking EV concept models, Saloon and Space-Hub.

Bosch Mobility’s technology is enabling EVs to drive themselves to charging stations. It κέρδισε a CES Innovation Award, and the company outlined a hydrogen strategy, valet charging, and more.

Fig. 1: Automated valet charging. Source: Bosch press download

Σε άλλες ειδήσεις, το Ευρωπαϊκή Επιτροπή approved €902 million (~$987 million) to support Βόρειο Βόλτ’s construction of an EV battery plant.

Siemens Digital Industries και Voltaiq συνεργάστηκαν to accelerate battery manufacturing.

Allegro MicroSystems ανακοίνωσε an isolated gate-driver IC with critical safety features for e-Mobility and clean energy applications, including OBC/DCDC, solar inverter, and data center power supply.

Vietnamese automaker VinFast θα επενδύσει up to $2 billion to build an EV factory in Tamil Nadu, India, reports AP News.

Τέσλα μείωσε its EV range estimates as a new U.S. government vehicle-testing regulation kicks in, aiming to make sure automakers accurately reflect real-world performance, reports Reuters. The company also broke ground on its in-house διυλιστήριο λιθίου, in Corpus Christi, Texas.

In battery research, Εθνικό Εργαστήριο Argonne patented a υλικό καθόδου that replaces lithium ions with sodium, which would be much cheaper for EVs. To reduce weight and increase EV range, Oak Ridge National Laboratory (ORNL) developed a metal-free current collector made of a polymer-based composite with carbon fibers. Πανεπιστήμιο του Χάρβαρντ ανέπτυξε ένα μπαταρία λιθίου that can be charged and discharged at least 6,000 times. And Εθνικό Εργαστήριο Βορειοδυτικού Ειρηνικού (PNNL) and Microsoft quickly found a new battery material by using advanced AI and high-performance computing (HPC).

Ασφάλεια

The National Institute of Standards and Technology and partners published a report about αντίπαλη μηχανική μάθηση attacks and mitigations as part of NIST’s effort to support the development of trustworthy AI.

Fig. 2: An AI system can malfunction if an adversary finds a way to confuse its decision making. Source: NIST

Ερευνητές στο Πανεπιστήμιο George Mason και Πανεπιστήμιο Queen Belfast λεπτομερής hardware Trojans obfuscation (HTO) methodologies for ASICs and FPGAs, and evaluated their approach using TrustHub benchmark.

Υπηρεσία Κυβερνοασφάλειας και Ασφάλειας Υποδομών (έλαμψε) εκδίδεται various alerts with τρωτά σημεία σχετικά με πλίθα και Apple, Και ένα Ιβάντι ενημερωμένη έκδοση ασφαλείας to address authentication bypass and command injection vulnerabilities.

Pervasive Computing και AI

Η επαυξημένης πραγματικότητας (AR) market is projected to grow by 54% year over year in 2024, reports Counterpoint, reversing three years of straight decline. Extended Reality (XR) headset shipments are expected to increase by a record 3.9 million units.

Not surprisingly, augmented reality and AI featured strongly at CES 2024:

  • Siemens συνεργάστηκε με Sony on an immersive engineering solution combining a head mounted display with Xcelerator software.
  • Siemens θα ενσωματώσει Amazon Bedrock AI models service into its Mendix low-code development platform to enable customers to easily incorporate generative AI in applications.
  • Synopsys και Packetcraft are συνεργαζόμενοι to integrate Packetcraft’s Bluetooth Qualified 5.4 Host software with Synopsys’ Bluetooth LE radio and link layer controller IP.
  • Sony launched an immersive δημιουργία χωρικού περιεχομένου system with an XR head-mounted display and a pair of controllers for intuitive interaction with 3D objects and precise pointing.
  • Applied Materials και Google said they are collaborating on advanced technologies for επαυξημένης πραγματικότητας (CA).
  • omnivision άνεργος a small form factor liquid crystal on silicon (LCOS) panel that integrates the LCOS array, driving circuit, frame buffer, and interface in a single chip for AR/XR/MR glasses.
  • Brewer Science introduced next-gen water quality sensing συστήματα.

The market value of consumer electronics Ανίχνευση 3D VCSEL is expected to reach US$1.404 billion by 2028, with an estimated CAGR of about 11% from 2023 to 2028, reports TrendForce. “The upcoming 2024 launch of the Apple Vision Pro, equipped with a trio of cutting-edge 3D sensing technologies — Structured Light, Direct Time of Flight (dToF), and Active Stereo Vision — is poised to significantly propel the 3D sensing market.” AR and VR products from Sony, Meta, Microsoft, να Google will fuel further growth.

Η Wi-Fi Alliance οριστικοποιήθηκε its certification program for the Wi-Fi 7 specification. Wi-Fi 7 includes features such as 320MHz channels, multi-link operation, 4K quadrature amplitude modulation (QAM), and 512 compressed block-ack.

Ατμοσφαιρικές Τεχνολογίες εισήγαγε a line of SoCs that support Bluetooth LE 5.4 as well as IEEE 802.15.4 based protocols including Thread and Matter for ultra-low power end IoT devices.

SiLC Technologies unveiled the Eyeonic Vision System Mini with precision LiDAR technology targeted to machine vision applications including robotics, warehouse logistics, and industrial automation.

Εργαστήριο Berkeley scientists developed multipurpose, recyclable nanosheets for electronics, energy storage, and health and safety applications.

Deloitte announced Atlas AI built on the NVIDIA AI and NVIDIA Omniverse platforms with a novel drug discovery accelerator to expedite research and bring new drugs to market faster by using generative AI models.

Πανεπιστήμιο της Οξφόρδης researchers used machine learning to close the reality gap, a difference between predicted and observed behavior from κβαντικές συσκευές.

A soft, wearable robot can help a person living with Parkinson’s walk without freezing, according to Πανεπιστήμιο του Χάρβαρντ και Πανεπιστήμιο της Βοστώνης ερευνητές.

Τα ρομπότ μπορούν execute complex plans more transparently when trained on multiple AI models, according to researchers at MIT’s Improbable AI Lab. “Each foundation model captures a different part of the decision-making process and then works together when it’s time to make decisions.”

Google was ordered to stop using jurors’ private information during jury selection in U.S. District Court in Massachusetts. Google is the defendant in a patent infringement lawsuit κατατέθηκε από Singular Computing over an AI chip. Singular is seeking $1.67 billion damages, according to Reuters.

Αναφορές σε βάθος

More new stories by the Semiconductor Engineering team.

Χαμηλή ισχύς-Υψηλή απόδοση:

  • Special Report: The problem of glitch power is particularly acute in AI accelerators, and fixes require some complex tradeoffs.
  • Corporate restructuring has been increasing over the past decade, and often it is more difficult to incorporate than technological advances due to the siloed nature της βιομηχανίας ημιαγωγών.
  • Expert discussion: From attempts to resolve thermal and power issues to the roles of CXL and UCIe, the future holds several opportunities for memory.
  • Expert discussion: Tools and optimizations are needed for SRAM to play a role in AI hardware while other memories are making inroads.

Δοκιμή, μέτρηση και ανάλυση:

  • Ο στόχος της failure analysis labs is to find the causes of failures faster and much earlier — preferably before first silicon.
  • Consistent unique identifiers can help plug gaps in the IC supply chain.
  • Video: Using internal deep data to determine failure rates and how close an individual device is to failure.

Εκδηλώσεις

Βρείτε την επερχόμενη βιομηχανία τσιπ εκδηλώσεις εδώ, Μεταξύ των οποίων:

Συμβάν Ημερομηνία Τοποθεσία
Automotive World: Έκθεση Advanced Automotive Technology 24 Ιανουαρίου - 26 Ιανουαρίου Τόκιο, Ιαπωνία
Ταχύτητα, πρωτόκολλο και ασφάλεια: Νέες προκλήσεις δικτύου αυτοκινήτου Jan 24 Νόβι, ΜΙ
SPIE Photonics West 27 Ιανουαρίου - 1 Φεβρουαρίου San Francisco, CA
DesignCon 2024 30 Ιανουαρίου - 1 Φεβρουαρίου Σάντα Κλάρα, Καλιφόρνια
Σύνοδος Κορυφής Chiplet 6 – 8 Φεβρουαρίου Σάντα Κλάρα, Καλιφόρνια
Η άνοδος των φωτονικών υπολογιστών 7 – 8 Φεβρουαρίου San Jose, CA
Συμπόσιο συσκευασίας σε επίπεδο γκοφρέτας 13 – 15 Φεβρουαρίου Αεροδρόμιο Hyatt Regency San Francisco
Διεθνές Συνέδριο Κυκλωμάτων Στερεάς Κατάστασης IEEE 2024 (ISSCC) Φεβ 18 - Φεβ 22 San Francisco, CA
Διάσκεψη προγραμματιστών PCI-SIG Φεβ 19 - Φεβ 20 Ταϊπέι, Ταϊβάν
Όλες οι προσεχείς εκδηλώσεις

Τα επερχόμενα διαδικτυακά σεμινάρια είναι εδώ.

Περαιτέρω ανάγνωση και ενημερωτικά δελτία

Διαβάστε τα τελευταία ειδικές αναφορές και κορυφαίες ιστορίες, ή ελέγξτε τα πιο πρόσφατα ενημερωτικά δελτία:

Συστήματα και Σχεδιασμός
Χαμηλή απόδοση-υψηλή απόδοση
Δοκιμή, μέτρηση και ανάλυση
Κατασκευή, Συσκευασία και Υλικά
Αυτοκίνητο, Ασφάλεια και Διάχυτος Υπολογιστής

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