ব্লগ পর্যালোচনা: ফেব্রুয়ারী 22

ব্লগ পর্যালোচনা: ফেব্রুয়ারী 22

উত্স নোড: 1972402

FPGA complexity mirrors ASIC path; integrating lasers and active gain elements; RISC-V in space; mixing power and data transmission in automotive; lightweight crypto.

জনপ্রিয়তা

সিমেন্স EDA এর হ্যারি ফস্টার observes that the FPGA market continues to go through a similar complexity curve that the IC/ASIC market experienced in the early and mid-2000 timeframe.

সিনোপসি' Mitch Heins explores the benefits of heterogeneous integration of lasers and active gain elements in a silicon-based photonic IC, including reduced system costs, size, weight, and power along with improved reliability and yield.

ক্যাডেন্সের পল ম্যাকলেলান checks out NASA’s efforts to build a new high-performance computer for space based on RISC-V and some of the critical requirements for such a processor.

রেনেসাস' Tobias Belitz examines how Power over Data Line can be used to reduce the number of cables in a vehicle and still accommodate the growing number of sensors by mixing power and data transmission first and separating them later.

Riscure এর মার্ক উইটম্যান explains how the lightweight crypto algorithm selected by NIST can deliver both encryption and integrity verification at a low cost for IoT and other resource-constrained devices.

একটি পডকাস্ট, আর্ম এর জিওফ হুইলরাইট and Remy Pottier join 311 Institute’s Matt Griffin to chat about the links between the metaverse and digital twins as well as potential applications in both enterprise and consumer markets.

Ansys' Alex Lam uses observations combined with simulation to determine the circumstances surrounding the crash of the spent Long March 3C rocket into the Moon.

SEMI এর Mousumi Bhat points to five key capability characteristics modern leaders need to possess in order to be able to merge sustainability with business strategy.

Verification blogger নিল জনসন argues that while simulation code coverage and formal code coverage represent fundamentally different information, there is value in merging coverage from different sources.

স্মৃতি বিশ্লেষক জিম হ্যান্ডি examines the current state of the memory market as companies report lower revenues, gigabyte shipments, and prices, plus how the cycle is likely to develop with a turnaround on the way.

ইন্টেলের Hechen Wang explains analog approaches to in-memory computing for AI applications and the efforts to balance energy efficiency and accuracy.

ওয়েস্টার্ন ডিজিটাল এর রনি সেন্দার checks out a startup looking to build the first data center on the moon  to safeguard data from increasing climate change induced unpredictability on Earth.

NXP এর Meindert van den Beld envisions a transformation of vehicle architecture in which all functions will be designed, tested, validated, and possibly modified on a virtual model that will exist alongside the physical car throughout its lifetime.

এনভিডিয়া Somshubra Majumdar introduces a method to select models that can balance the recognition accuracy of general speech with the help of adapter modules for transducer-based speech recognition systems.

Marvell’s Amit Sanyal expects that we are on the verge of a major retrofit of the underlying technologies for networking in data centers, with an increasing focus on power efficiency and telemetry data.

এবং সাম্প্রতিক বৈশিষ্ট্যযুক্ত ব্লগগুলি মিস করবেন না৷ উত্পাদন, প্যাকেজিং এবং উপকরণ নিউজলেটার:

প্রযুক্তি সম্পাদক ক্যাথরিন ডার্বিশায়ার pinpoints what to watch for in lithography and patterning at SPIE and beyond.

আমকোরের Brendan Wells explains how AiP/AoP modules can replace RF SoC, baseband SoC, surface mount technology matching circuits, and a discrete antenna.

Coventor এর স্যান্ডি ওয়েন looks at the benefits of reducing wiring congestion at the most advanced nodes.

MITRE-Engenuity’s Raj Jammy lays out what needs to be done to create a robust semiconductor workforce, and what lessons can be learned from the past.

SEMI এর Ashley Huang highlights key issues in establishing a multi-vendor chiplet ecosystem.

ইবিম ইনিশিয়েটিভ Harry Levinson summarizes the lithography challenges and advancements at the most advanced process nodes.

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