NexGen appoints chief systems officer to lead Global Systems Engineering group Source Cluster: lSemiconductor Today News Source Node: 1886333Time Stamp: Feb 2, 2022
pSemi introduces complete 5G mmWave RF front-end solution Source Cluster: lSemiconductor Today News Source Node: 1886296Time Stamp: Feb 2, 2022
PCSEL firm Vector Photonics appoints process engineer Source Cluster: lSemiconductor Today News Source Node: 1598488Time Stamp: Jan 31, 2022
Smartphone shipments down 3.2% year-on-year in Q4, but full-year 2021 still up 5.7% Source Cluster: lSemiconductor Today News Source Node: 1597821Time Stamp: Jan 31, 2022
Apple iPhone tops smartphone market in Q4/2021, but Samsung remains top for full year Source Cluster: lSemiconductor Today News Source Node: 1596507Time Stamp: Jan 28, 2022
IVWorks acquires Saint-Gobain’s GaN wafer business Source Cluster: lSemiconductor Today News Source Node: 1594034Time Stamp: Jan 25, 2022
CSA Catapult appoints Raj Gawera as non-executive director Source Cluster: lSemiconductor Today News Source Node: 1590216Time Stamp: Jan 20, 2022
University of Surrey produces record strain in single-crystal silicon Source Cluster: lSemiconductor Today News Source Node: 1590220Time Stamp: Jan 20, 2022
Micro-LED chip market for large-sized displays to grow at 204% CAGR from $54m in 2022 to $4.5bn in 2026 Source Cluster: lSemiconductor Today News Source Node: 1589505Time Stamp: Jan 19, 2022
EVG launches automated SmartNIL nanoimprint and wafer-level optics system Source Cluster: lSemiconductor Today News Source Node: 1589511Time Stamp: Jan 19, 2022
ULTRARAM memory demonstrated on silicon wafers for first time Source Cluster: lSemiconductor Today News Source Node: 1579941Time Stamp: Jan 13, 2022
Gelest names CTO Jonathan Goff as president Source Cluster: lSemiconductor Today News Source Node: 1576754Time Stamp: Jan 12, 2022
Iowa State names Liang Dong as Microelectronics Research Center’s new director Source Cluster: lSemiconductor Today News Source Node: 1883984Time Stamp: Jan 11, 2022
GaN Systems releases GeN2 Class-D audio amplifier and companion SMPS reference design Source Cluster: lSemiconductor Today News Source Node: 1573556Time Stamp: Jan 10, 2022
GaN Systems and Axign unveil 500W heatsinkless Class-D audio amplifier at CES Source Cluster: lSemiconductor Today News Source Node: 1883501Time Stamp: Jan 7, 2022
Voyant raises $15.4m in Series A funding to deliver 3D sensing with chip-scale LiDAR Source Cluster: lSemiconductor Today News Source Node: 1573562Time Stamp: Jan 6, 2022
Fraunhofer IAF director Ambacher steps down after 14 years Source Cluster: lSemiconductor Today News Source Node: 1573567Time Stamp: Jan 5, 2022
EPC introduces 12V–48V 500W GaN boost converter demo board with same BOM size as silicon Source Cluster: lSemiconductor Today News Source Node: 1573571Time Stamp: Jan 4, 2022
Smartphone production to return to pre-pandemic level in 2022 Source Cluster: lSemiconductor Today News Source Node: 1882432Time Stamp: Nov 17, 2021
Vector Photonics appoints development engineer, responsible for active testing of PCSEL devices Source Cluster: lSemiconductor Today News Source Node: 1554253Time Stamp: Nov 16, 2021