Wyzwania w opakowaniach 5G i 6G

Millimeter wave frequencies are essential for transferring more data more quickly, but they also requires different packaging technology to minimize loss and drift. That opens up a number of tradeoffs around antenna in package, antenna on package, flexible circuits, and different substrates. Curtis Zwenger, vice president of R&D at Amkor Technology, talks about a host of new challenges ranging from over-the-air testing and cross-talk to impedance matching.

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