The Global Market For Advanced Semiconductor Packaging 2024-2035

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Published: January 2024.
पेज: 330
टेबल्स: 22
आंकड़े: 25
सीरीज: इलेक्ट्रानिक्स

The global landscape of semiconductor manufacturing is rapidly evolving, with advanced packaging emerging as a critical component of manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. Advanced packaging allows for the creation of faster, cost-effective systems by integrating various chips, a technique that’s increasingly essential given the physical limitations of traditional chip miniaturization. It is reshaping the industry, enabling the integration of diverse chip types and enhancing processing speeds.

The U.S. government recognizes the importance of advanced packaging and has introduced a $3 billion National Advanced Packaging Manufacturing Program aimed at establishing high-volume packaging facilities by the end of the decade. The focus on packaging complements the existing efforts under the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.

The Global Market for Advanced Semiconductor Packaging 2024-2035 provides a comprehensive analysis of the global advanced semiconductor packaging technologies market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values in the billions (USD) by type, region, and end-use application.

Trends analyzed include heterogeneous integration, interconnects, thermal solutions, miniaturization, supply chain maturity, simulation/data analytics. Leading companies profiled include TSMC, Samsung, Intel, JCET, Amkor. Applications covered include AI, mobile, automotive, aerospace, IoT, communications (5G/6G), high performance computing, medical, and consumer electronics.

Regional markets explored include North America, Asia Pacific, Europe, China, Japan, and RoW. The report also assesses drivers like ML/AI, data centers, EV/ADAS; challenges like costs, complexity, reliability; emerging approaches like system-in-package, monolithic 3D ICs, advanced substrates, novel materials. Overall an in-depth benchmark analysis of the opportunities within the advancing semiconductor packaging industry.

रिपोर्ट सामग्री में शामिल हैं:

Market size and forecasts
Key technology trends
Growth drivers and challenges
प्रतिस्पर्धी परिदृश्य विश्लेषण
Future packaging trends outlook
In-depth analysis of wafer level packaging (WLP)
System-in-Package (SiP) and heterogeneous integration
Monolithic 3D ICs overview
Advanced semiconductor packaging applications across key markets: AI, mobile, automotive, aerospace, IoT, communications, HPC, medical, consumer electronics
Regional market breakdown
Assessment of key industry challenges: complexity, costs, supply chain maturity, standards
Company profiles: Strategies and technologies of 90 key players. Companies profiled include 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Corporation, Leader-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Box, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Company (TSMC) and Yuehai Integrated.

1 अनुसंधान पद्धति 14

2 कार्यकारी सारांश 15

2.1 Semiconductor Packaging Technology Overview 16
- 2.1.1 Conventional packaging approaches 19
- 2.1.2 Advanced packaging approaches 20
2.2 Semiconductor Supply Chain 22
2.3 Key Technology Trends in Advanced Packaging 22
2.4 Market Size and Growth Projections (Billions USD) 24
- 2.4.1 By packaging type 24
- 2.4.2 बाज़ार द्वारा 26
- 2.4.3 क्षेत्र द्वारा 28
2.5 Market Growth Drivers 30
2.6 Competitive Landscape 32
2.7 Market Challenges 34
2.8 हाल के बाज़ार समाचार और निवेश 36
2.9 भविष्य का दृष्टिकोण 38
- 2.9.1 Heterogeneous Integration 39
- 2.9.2 Chiplets and Die Disaggregation 41
- 2.9.3 Advanced Interconnects 43
- 2.9.4 Scaling and Miniaturization 45
- 2.9.5 Thermal Management 47
- 2.9.6 Materials Innovation 48
- 2.9.7 Supply Chain Developments 50
- 2.9.8 Role of Simulation and Data Analytics 52

3 SEMICONDUCTOR PACKAGING TECHNOLOGIES 58

3.1 Transistor Device Scaling 58
- 3.1.1 सिंहावलोकन 58
3.2 Wafer Level Packaging 61
3.3 Fan-Out Wafer Level Packaging 62
3.4 Chiplets 64
3.5 Interconnection in Semiconductor Packaging 67
- 3.5.1 सिंहावलोकन 67
- 3.5.2 Wire bonding 67
- 3.5.3 Flip-chip bonding 69
- 3.5.4 Through-silicon via (TSV) bonding 72
- 3.5.5 Hybrid bonding with chiplets 73
3.6 2.5D and 3D Packaging 75
- 3.6.1 2.5D packaging 75
  - 3.6.1.1 अवलोकन 76
    - 3.6.1.1.1 2.5D vs. 3D Packaging 76
  - 3.6.1.2 Benefits 77
  - 3.6.1.3 चुनौतियाँ 79
  - 3.6.1.4· रुझान 80
  - 3.6.1.5 बाज़ार खिलाड़ी 81
  - 3.6.1.6 2.5D Organic-based packaging 83
  - 3.6.1.7 2.5D glass-based packaging 84
- 3.6.2 3D packaging 88
  - 3.6.2.1 Benefits 89
  - 3.6.2.2 चुनौतियाँ 92
  - 3.6.2.3· रुझान 94
  - 3.6.2.4 Embedded Si bridges 96
  - 3.6.2.5 Si interposer 97
  - 3.6.2.6 3D Hybrid bonding 98
  - 3.6.2.7 बाज़ार खिलाड़ी 98
3.7 Flip Chip Packaging 102
3.8 Embedded Die Packaging 104
3.9 Trends in Advanced Packaging 106
3.10 Packaging Roadmap 108

4 WAFER-LEVEL PACKAGING 111

4.1 प्रस्तावना 111
4.2 Benefits 112
4.3 Types of Wafer Level Packaging 113
- 4.3.1 Wafer Level Chip Scale Packaging 114
  - 4.3.1.1 अवलोकन 114
  - 4.3.1.2 लाभ 114
  - 4.3.1.3 अनुप्रयोग 115
- 4.3.2 Fan-Out Wafer Level Packaging 117
  - 4.3.2.1 अवलोकन 117
  - 4.3.2.2 लाभ 117
  - 4.3.2.3 अनुप्रयोग 119
- 4.3.3 Wafer Level Fan-Out Packaging 120
  - 4.3.3.1 अवलोकन 120
  - 4.3.3.2 Benefits 121
  - 4.3.3.3 अनुप्रयोग 122
- 4.3.4 Other Types of WLP 123
4.4 WLP Manufacturing Processes 124
- 4.4.1 Wafer Preparation 124
- 4.4.2 RDL Buildup 125
- 4.4.3 Bumping 126
- 4.4.4 Encapsulation 127
- 4.4.5 Integration 128
- 4.4.6 Test and Singulation 129
4.5 Wafer Level Packaging Trends 131
4.6 Applications of Wafer Level Packaging 133
- 4.6.1 Mobile and Consumer Electronics 133
- 4.6.2 Automotive Electronics 134
- 4.6.3 IoT and Industrial 135
- 4.6.4 High Performance Computing 136
- 4.6.5 Aerospace and Defense 137
4.7 Wafer Level Packaging Outlook 138

5 SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION 139

5.1 प्रस्तावना 139
5.2 Approaches for heterogenous integration 141
5.3 SiP Manufacturing Approaches 142
- 5.3.1 2.5D Integrated Interposers 143
- 5.3.2 Multi-Chip Modules 145
- 5.3.3 3D Stacked packages 146
- 5.3.4 Fan-Out Wafer Level Packaging 149
- 5.3.5 Flip Chip Package-on-Package 150
5.4 SiP Component Integration 152
5.5 Heterogeneous Integration Drivers 154
5.6 Trends Driving SiP Adoption 155
5.7 SiP Applications 156
5.8 SiP Industry Landscape 157
5.9 Outlook on Heterogeneous Integration 160

6 MONOLITHIC 3D IC 162

6.1 सिंहावलोकन 162
6.2 Benefits 164
6.3 Challenges 165
6.4 भविष्य का दृष्टिकोण 166

7 बाज़ार और अनुप्रयोग 168

7.1 Market value chain 168
7.2 Packaging trends by market 169
7.3 Artificial Intelligence (AI) 170
- 7.3.1 अनुप्रयोग 171
- 7.3.2 पैकेजिंग 172
7.4 Mobile and Handheld Devices 172
- 7.4.1 अनुप्रयोग 173
- 7.4.2 पैकेजिंग 173
7.5 High Performance Computing 175
- 7.5.1 अनुप्रयोग 175
- 7.5.2 पैकेजिंग 176
7.6 Automotive Electronics 179
- 7.6.1 अनुप्रयोग 179
- 7.6.2 पैकेजिंग 179
7.7 Internet of Things (IoT) Devices 180
- 7.7.1 अनुप्रयोग 181
- 7.7.2 पैकेजिंग 181
7.8 5G & 6G Communications Infrastructure 182
- 7.8.1 अनुप्रयोग 182
- 7.8.2 पैकेजिंग 182
7.9 Aerospace and Defense Electronics 185
- 7.9.1 अनुप्रयोग 185
- 7.9.2 पैकेजिंग 187
7.10 Medical Electronics 188
- 7.10.1 अनुप्रयोग 188
- 7.10.2 पैकेजिंग 189
7.11 Consumer Electronics 189
- 7.11.1 अनुप्रयोग 189
- 7.11.2 पैकेजिंग 190
7.12 Global market (Units) 193
- 7.12.1 By market 193
- 7.12.2 Regional markets 196
  - 7.12.2.1 एशिया प्रशांत 197
    - 7.12.2.1.1 चीन 198
    - 7.12.2.1.2 Taiwan 199
    - 7.12.2.1.3 Japan 200
    - 7.12.2.1.4 South Korea 201
  - 7.12.2.2 उत्तरी अमेरिका 202
    - 7.12.2.2.1 United States 203
    - 7.12.2.2.2 Canada 204
    - 7.12.2.2.3 Mexico 205
  - 7.12.2.3 यूरोप 206
    - 7.12.2.3.1 Germany 208
    - 7.12.2.3.2 France 209
    - 7.12.2.3.3 United Kingdom 210
    - 7.12.2.3.4 Nordic Countries 211
  - 7.12.2.4 Rest of World 212

8 MARKET PLAYERS 215

8.1 Integrated Device Manufacturers 215
8.2 Outsourced Semiconductor Assembly and Test (OSAT) Companies 217
8.3 Foundries 218
- 8.3.1 Semiconductor foundries technology roadmaps 218
8.4 Electronics OEMs 220
8.5 Packaging Equipment and Materials Companies 222

9 MARKET CHALLENGES 225

9.1 Technical Complexity 225
9.2 Supply Chain Maturity 226
9.3 Cost 227
9.4 मानक 228
9.5 Reliability Assurance 229

10 कंपनी प्रोफाइल 230 (90 कंपनी प्रोफाइल)

11 संदर्भ 317

तालिकाओं की सूची

Table 1. Key Technology Trends in Advanced Packaging. 23
Table 2. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type. 24
Table 3. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market. 26
Table 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region. 28
Table 5. Market Growth Drivers for advanced semiconductor packaging. 30
Table 6. Challenges Facing Advanced Packaging Adoption. 34
Table 7. Recent advanced semiconductor packaging market news and investments. 36
Table 8. Challenges in transistor scaling. 60
Table 9. Specifications of interconnection methods. 67
Table 10. 2.5D vs. 3D packaging. 76
Table 11. 2.5D packaging challenges. 79
Table 12. Market players in 2.5D packaging. 81
Table 13. Advantages and disadvantages of 3D packaging. 88
Table 14. Trends in Advanced Packaging. 106
Table 15. Key trends shaping wafer level packaging. 131
Table 16. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages. 154
Table 17. Benefits of monolithic 3D ICs. 164
Table 18. Challenges of monolithic 3D ICs. 165
Table 19. Advanced semiconductor packaging market value chain. 168
Table 20. Markets and applications for advanced semiconductor packaging. 170
Table 21. Advanced semiconductor packaging (units), 2020-2025, by market. 193
Table 22. Advanced semiconductor packaging (units), 2020-2025, by region. 195

आंकड़ों की सूची

Figure 1. Timeline of different packaging technologies. 19
Figure 2. Evolution roadmap for semiconductor packaging. 20
Figure 3. Semiconductor Supply Chain. 22
Figure 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type. 25
Figure 5. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market. 26
Figure 6. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region. 28
Figure 7. Advanced semiconductor packaging (units), 2020-2025, by market. 56
Figure 8. Scaling technology roadmap. 59
Figure 9. Wafer-level chip scale packaging (WLCSP) 61
Figure 10. Embedded wafer-level ball grid array (eWLB). 62
Figure 11. Fan-out wafer-level packaging (FOWLP). 63
Figure 12. Chiplet design. 64
Figure 13. 2D chip packaging. 75
Figure 14. 2.5D-integrated packaging on a silicon interposer. 79
Figure 15. RDL fabrication. 79
Figure 16. Three-die, wire-bond semiconductor assembly. 90
Figure 17. 3D integration roadmap. 95
Figure 18. Projected timelines for packaging and interconnects. 109
Figure 19. Typical WLCSP structure. 114
Figure 20. Typical FOWLP structure, 117
Figure 21. 2.5D chiplet integration. 143
Figure 22. Advanced semiconductor packaging (units), 2020-2025, by market. 194
Figure 23. Advanced semiconductor packaging (units), 2020-2025, by region. 196
Figure 24. 2.5D Molded Interposer on Substrate (MIoS) package. 291
Figure 25. 12-layer HBM3. 297

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